Socket apparatus for removably mounting electronic packages
AssigneeTexas Instruments Incorporated
InventorKiyokazu Ikeya
Life of this patent
Estimating the term…
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AssigneeTexas Instruments Incorporated
InventorKiyokazu Ikeya
Estimating the term…
A socket (1) has a base (10) which forms a recess (10d) for receiving a support member (12). The support member (12) has a recessed surface (12a) for carrying a contact film (14) and has bores for mounting spring contact elements (15). The spring contact elements engage contact members (14b) of contact film (14) from below the film. An adapter (13) has a seat (13b) for a BGA package (2) for exposing solder balls (2a) to contact members (14b) from a location above the film. Socket terminal pins (11b) are electrically connected to spring contact elements (15) through circuit paths (13c) on a pitch expansion substrate (11). A cover (20) and a compression member (30) apply a force to the package.
A socket for removably receiving an electronic package having a plurality of terminals arranged according to a selected pattern, the socket connecting each electronic package terminal to a respective socket terminal for connection in turn to a respective circuit path on a substrate comprising:
Dependencies are inferred from the claim text.