Electrode forming method and bump electrode formable base used therefor
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorYoshie Noguchi
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Abstract
A semiconductor device is mounted on a heating stage, and the temperature of the semiconductor device is set to be at least 60° C. and lower than the melting point of the solder. With the use of an ejecting head, the molten solder is ejected from a nozzle towards an electrode part. The molten solder ejected from the ejecting head impinges upon the surface of the electrode part. By impingement, the molten solder spreads over the surface of the electrode part by wetting, thereby to form a bump electrode on the electrode part. This ensures a joining strength between the bump electrode and the underlying conductive region.
Claims11
An electrode forming method for forming a bump electrode on an underlying conductive region, comprising:
- an electrode forming step of ejecting a molten solder for adhesion onto said underlying conductive region that has been set at a temperature of at least 60° C. and lower than a melting point of the solder.
An electrode forming method including an electrode forming step for forming a bump electrode on an underlying conductive region, wherein said electrode forming step includes a step of forming a projection on a surface of said underlying conductive region and ejecting a molten solder towards said projection for adhesion.
A bump electrode formable base in which a bump electrode is to be formed on an underlying conductive region by ejecting a molten solder towards said underlying conductive region, wherein said bump electrode formable base includes a projection formed in said underlying conductive region for breaking an oxide coat present on a surface of said molten solder when said molten solder impinges upon said underlying conductive region.
Dependencies are inferred from the claim text.