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US 2002/0055049 A1Published application
Method and apparatus for forming resist pattern
AssigneeOki Electric Industry Co., Ltd.
InventorMinoru Watanabe
Life of this patent
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Abstract
A method of forming a resist pattern on a substrate, comprises the steps of: forming a resist film on the substrate, supplying a developing solution onto the resist film, submerging the substrate and the resist film formed thereon in a rinsing liquid kept in a rinsing tank, and applying ultrasonic vibration to the rinsing liquid to rinse the developing solution from the resist film submerged in the rinsing liquid.
Claims4
A method of forming a resist pattern on a substrate, comprising the steps of:
- forming a resist film on the substrate;
- supplying a developing solution onto the resist film;
- and
- submerging the substrate and the resist film formed thereon in a rinsing liquid kept in a rinsing tank;
- and
- applying ultrasonic vibration to the rinsing liquid to rinse the developing solution from the resist film submerged in the rinsing liquid.
3 more elements
An apparatus for forming a resist pattern on a substrate comprising:
- a rinsing tank which keeps rinsing liquid for rinsing developing solution remaining on a resist film formed on the substrate;
- and
- an ultrasonic vibration mechanism which applies ultrasonic vibration to the rinsing liquid kept in said rinsing tank.
Dependencies are inferred from the claim text.