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AssigneeKulicke & Soffa Investments, Inc.
InventorsTIMOTHY W. ELLIS, NIKHIL MURDESHWAR, MARK A. ESHELMAN, CHRISTIAN RHEAULT
Estimating the term…
Methods for protecting the surface of an uninsulated portion of a copper circuit from environmental contamination detrimental to joining the surface to another metal surface, said method comprising the step of coating the surface with a layer of a ceramic material having a thickness that is suitable for soldering without fluxing and that is sufficiently frangible when the surfaces are being joined to obtain metal-to-metal contact between the surfaces. Coated electronic packages including semiconductor wafers are also disclosed.
A method for protecting the surface of an uninsulated portion of a copper circuit from environmental contamination detrimental to joining the surface to another metal surface, said method comprising the step of coating the surface with a layer of a ceramic material having a thickness that is suitable for soldering without fluxing and that is sufficiently frangible when the surfaces are being joined to obtain metal-to-metal contact between the surfaces.
An electronic package comprising an uninsulated portion of a copper circuit coated with a surface layer of a ceramic material having a thickness that is suitable for soldering without fluxing and that is sufficiently frangible when the surfaces are being joined to obtain metal-to-metal contact between the surfaces.
An electronic package comprising an uninsulated portion of a copper circuit coated with a surface layer of a material selected from the group consisting of copper-rare earth metal complexes and copper-immiscible metals that form metal hydride compounds, said surface layer having a thickness that, upon exposure to a reducing environment containing hydrogen, forms a hydride layer having a thickness that is suitable for soldering without fluxing and that provides the layer with a hardness that is sufficiently frangible when the surfaces are being joined to obtain metal-to-metal contact between the surfaces.
An electronic package comprising an uninsulated portion of a copper circuit coated with a surface layer of a rare earth metal that forms a copper complex, said surface layer having a thickness that, upon formation of said copper complex and exposure to a reducing environment comprising hydrogen, forms a hydride layer having a thickness that is suitable for soldering without fluxing and that is sufficiently frangible when the surfaces are being joined to obtain metal-to-metal contact between the surfaces.
An electronic package comprising an uninsulated portion of a copper circuit coated with a surface layer of a metal hydride compound selected from the group consisting of metal hydrides of copper-rare earth metal complexes and metal hydrides of copper-immiscible metals that form metal hydrides, said surface layer having a thickness that is suitable for soldering without fluxing and that is sufficiently frangible when the surfaces are being joined to obtain metal-to-metal contact between the surfaces.
Dependencies are inferred from the claim text.