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AssigneeSiliconware Precision Industries Co., Ltd.
InventorsLee Ming-Hsun, Chen Chin-Te
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The present invention provides schemes which are associated with wire bonding process or wire bonding machine to detect the bonding status of a bonding wire of a package including at least a semiconductor unit. The schemes are very useful to a BGA (Ball Grid Array) package or similar types of packages, and provide significant advantages particularly for a package in which the resistance (such as the resistance resulting from an adhesion layer and a layer of Cupric Oxide for promoting adhesion) between a semiconductor unit and its carrier is not low enough. The present invention is characterized in that a preset connection between a semiconductor unit and a package-connection-area (such as the solder ball pad of a ball grid array package) is established in the beginning of a wire bonding process, and the package-connection-area is electrically connected with a press plate used by the wire bonding machine or the wire bonding process, so that a current loop can be formed via a bonding wire, the preset connection, the package-connection-area, and the press plate when the bonding wire is bonded to a semiconductor unit, and the bonding status between the bonding wire and the semiconductor unit can be indicated according to the current flowing through the current loop. The present invention is also applicable to the detection of bonding status between a bonding wire and a bonding finger electrically connected to a package-connection-area of the package.
A system associated with a wire bonding process, for detecting bonding status of at least a bonding wire of a package including at least a semiconductor unit and at least a package-connection-means, said system comprising:
A method associated with a wire bonding machine, for detecting bonding status of a bonding wire of a package including at least a semiconductor unit and at least a package-connection-means, said semiconductor unit and said package-connection-means being supported by at least a carrier with said package-connection-means exposed, said method comprising the steps of:
A method associated with a wire bonding machine, for detecting bonding status of a bonding wire of a package including at least a semiconductor unit and at least a package-connection-means, said semiconductor unit and said package-connection-means being supported by at least a carrier with said package-connection-means exposed, said method comprising the steps of:
Dependencies are inferred from the claim text.