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US 2002/0053733 A1Published application
Multi-chip module system and method of fabrication
AssigneeMicron Technology, Inc.
InventorsSalman Akram, David R. Hembree, James M. Wark
Life of this patent
Estimating the term…
Abstract
Multi-chip module systems and method of fabrication thereof wherein the equivalent of a failed die of a multi-chip module (MCM) is added to the module in a vacancy position previously constructed with appropriate electrical connections. A variety of different dice may be attached to the same vacancy position of an MCM by means of adapters, wherein each adapter has the same footprint, but different adapters are capable of accommodating different numbers and types of dice.
Claims36
A multi-chip module system comprising:
- a substrate having at least a first position having, in turn, a predetermined configuration for locating a first semiconductor device thereat and having at least one other vacant position having, in turn, a predetermined configuration for locating a second semiconductor device thereat on the multi-chip module system;
- and
- a first semiconductor device located in the first position of the substrate for use in said multi-chip module system, the first semiconductor device having a first predetermined performance characteristic.
A multi-chip module system comprising:
- a substrate having a first position having, in turn, a predetermined configuration for locating a first semiconductor device thereat, having a second position having, in turn, a predetermined configuration for locating a second semiconductor device thereat, and having at least one other vacant position having, in turn, a predetermined configuration for locating a third semiconductor device thereat on the multi-chip module system;
- a first semiconductor device located in the first position of the substrate for use in said multi-chip module system, the first semiconductor device having a first predetermined performance characteristic;
- and
- a second semiconductor device located in the second position of the substrate for use in said multi-chip module system, the second semiconductor device having a second predetermined performance characteristic.
1 more element
A multi-chip module system comprising:
- a substrate having a first position having, in turn, a predetermined configuration for locating a first semiconductor device thereat, having a second position having, in turn, a predetermined configuration for locating a second semiconductor device thereat, having a first vacant position having, in turn, a predetermined configuration for locating a third semiconductor device thereat, and having a second vacant position having, in turn, a predetermined configuration for locating a fourth semiconductor device thereat on the multi-chip module;
- a first semiconductor device located in the first position of the substrate for use in said multi-chip module system, the first semiconductor device having a first predetermined performance characteristic;
- and
- a second semiconductor device located in the second position of the substrate for use in said multi-chip module system, the second semiconductor device having a second predetermined performance characteristic.
1 more element
A multi-chip module system comprising:
- a substrate having at least a first predetermined configuration position for locating a first semiconductor device thereat and having at least one other vacant predetermined configuration position for locating a second semiconductor device thereat on the multi-chip module system;
- and
- a first semiconductor device located in the first predetermined configuration position of the substrate for use in said multi-chip module system, the first semiconductor device having a first predetermined performance characteristic.
A multi-chip module system comprising:
- a substrate having a first predetermined configuration position for locating a first semiconductor device thereat, having a second predetermined configuration position for locating a second semiconductor device thereat, and having at least one other vacant predetermined configuration position for locating a third semiconductor device thereat on the multi-chip module system;
- a first semiconductor device located in the first predetermined configuration position of the substrate for use in said multi-chip module system, the first semiconductor device having a first predetermined performance characteristic;
- and
- a second semiconductor device located in the second predetermined configuration position of the substrate for use in said multi-chip module system, the second semiconductor device having a second predetermined performance characteristic.
1 more element
A multi-chip module system comprising:
- a substrate having a first predetermined configuration position for locating a first semiconductor device thereat, having a second predetermined configuration position for locating a second semiconductor device thereat, having a first vacant predetermined configuration position for locating a third semiconductor device thereat, and having a second vacant predetermined configuration for locating a fourth semiconductor device thereat on the multi-chip module;
- a first semiconductor device located in the first predetermined configuration position of the substrate for use in said multi-chip module system, the first semiconductor device having a first predetermined performance characteristic;
- and
- a second semiconductor device located in the second predetermined configuration position of the substrate for use in said multi-chip module system, the second semiconductor device having a second predetermined performance characteristic.
1 more element
Dependencies are inferred from the claim text.