Heat dissipating structure for electronic apparatus
AssigneeKabushiki Kaisha Toshiba
InventorsKatsumi Hisano, Hideo Iwasaki, Yutaka Sata, Hiroshi Ubukata, Sadao Makita, Kentaro Tomioka
Life of this patent
Estimating the term…
Loading patent…
AssigneeKabushiki Kaisha Toshiba
InventorsKatsumi Hisano, Hideo Iwasaki, Yutaka Sata, Hiroshi Ubukata, Sadao Makita, Kentaro Tomioka
Estimating the term…
The present invention is intended to improve the heat radiating performance of an electronic apparatus provided with semiconductor devices which generate heat at a high rate. An air passage (20) is formed in a case 10, and a fan (6) produces air currents in the air passage (20). Heat generated by a heat-generative part (1) mounted on a circuit board (2) is transferred to a wall (21) included in walls defining the air passage (20) by a heat transfer member (3), such as a heat pipe, and is carried outside the case 10 by cooling air flowing through the air passage (20).
An electronic apparatus comprising:
An electronic apparatus comprising:
An electronic apparatus comprising:
An electronic apparatus comprising:
Dependencies are inferred from the claim text.