Cooling apparatus and cooling method for heating elements

Abstract

A cooling liquid 28 with a boiling temperature lower than the maximum allowed temperature for the operating atmosphere of switching elements 42 and which is highly insulative is used to liquid seal the switching elements 42. This cooling liquid 28 is cooled by a liquid cooler 50. The cooling liquid 28 vaporizes and removes the heat generated by the switching elements 42 to cool the switching elements 42. Vaporized cooling liquid 28 is cooled by the liquid cooler 50 and is liquefied. The switching elements 42 can be efficiently cooled and the size of the apparatus can be reduced.

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