Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components
AssigneeMicron Technology, Inc.
InventorsTONGBI JIANG, SYED S. AHMAD
Life of this patent
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Abstract
A method of forming high definition elements for electrical and electronic devices, substrates, and other components from or including viscous material. The method includes inverting the electrical components after the viscous material is applied and maintaining the inverted orientation until the viscous material dries or cures enough to maintain definition of its perimeter and edge characteristics.
Claims24
A method of controlling the spread of a material deposited on a semiconductor device component, comprising:
- providing said semiconductor device component;
- depositing said material on said semiconductor device component;
- and
- inverting said semiconductor device component until said material obtains a desired stable shape and boundary definition of said deposited material.
A method of controlling definition of surface features of a material deposited on a semiconductor device component, comprising:
- providing said semiconductor device component;
- depositing said material on said semiconductor device component;
- and
- inverting said semiconductor device component until said material obtains a desired stable shape and boundary definition of said deposited material.
A method of controlling the angle of repose of a material deposited on a semiconductor device component, comprising:
- providing said semiconductor device component;
- depositing said material on said semiconductor device component;
- and
- inverting said semiconductor device component until said material obtains a desired stable angle of repose of said deposited material.
A method of forming an adhesive patch, comprising:
- providing a semiconductor substrate;
- depositing an adhesive material on said semiconductor substrate;
- and
- inverting said semiconductor substrate until said adhesive material obtains a desired stable shape and boundary definition of said deposited adhesive material.
A semiconductor substrate having at least one adhesive patch formed by:
- providing a semiconductor substrate;
- depositing an adhesive material on said semiconductor substrate;
- and
- inverting said semiconductor substrate until said adhesive material obtains a desired stable shape and boundary definition of said deposited adhesive material.
A method of forming a conductive bump, comprising:
- providing a semiconductor substrate having at least one bond pad;
- forming a conductive bump on said semiconductor substrate bond pad with a conductive material;
- and
- inverting said semiconductor substrate until said conductive material obtains a desired stable shape and boundary definition of said deposited conductive material.
A printed circuit board having at least one conductive bump formed by:
- providing said printed circuit board with at least one bond pad;
- forming a conductive bump on said printed circuit board bond pad with a conductive material;
- and
- inverting said printed circuit board until said conductive material obtains a desired stable shape and boundary definition of said deposited conductive material.
A flip-chip having at least one conductive bump formed by:
- providing said flip-chip with at least one bond pad;
- forming a conductive bump on said flip-chip bond pad with a conductive material;
- and
- inverting said flip-chip until said conductive material obtains a desired stable shape and boundary definition of said deposited conductive material.
A method of forming an encapsulant on a semiconductor device, comprising:
- providing a semiconductor substrate having a semiconductor device attached thereto;
- depositing an encapsulant material on said semiconductor device and on a portion of said semiconductor substrate;
- and
- inverting said semiconductor substrate until said encapsulant material obtains a desired stable shape and boundary definition of said deposited encapsulant material.
A method of forming an adhesive coated lead frame, comprising:
- providing a lead frame having at least one lead finger;
- depositing an adhesive material on a portion of an attachment surface of said lead finger;
- and
- inverting said lead frame until said adhesive material obtains a desired stable shape and boundary definition of said deposited adhesive material.
An adhesive coated lead frame formed by:
- providing a lead frame having at least one lead finger;
- depositing an adhesive material on a portion of an attachment surface of said lead finger;
- and
- inverting said lead frame until said adhesive material obtains a desired stable shape and boundary definition of said deposited adhesive material.
A method of forming a conductive trace, comprising:
- providing a semiconductor substrate;
- forming a conductive trace on said semiconductor substrate with a conductive material;
- and
- inverting said semiconductor substrate until said conductive trace obtains a desired stable shape and boundary definition of said deposited conductive trace.
Dependencies are inferred from the claim text.