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AssigneeNEC Corporation
InventorTADAYOSHI MIYOSHI
Estimating the term…
The semiconductor package including a semiconductor element 11 having a first face 21a and a second face 21b which is opposite to the first face 21a, an electrode 22 provided on the first face 21a, and a conductive lead 23 connected to the electrode 22 comprises an insulating film member 24 provided on the second face 21b for connecting the other end of the lead, the lead 23 is bent as oppose to a side face of the semiconductor element 11, and is connected each other with an elastic force between the electrode 22 and the film member 24, a bent part of the lead between the electrode 22 and the film member 24 turns to be a terminal part 23a. The circuit board has a connection means, connecting to the terminal unit 23a, and having an adequate size for placing the semiconductor package 11. The connection means is constituted of an accommodation groove part 46 or a frame part 50, and a plurality of pattern electrodes 47a, 47b, and the terminal part 23a is connected between the pattern electrodes 47a, 47b.
A semiconductor package comprising:
A mounting structure for use in mounting a semiconductor package on an circuit board, said semiconductor package including a semiconductor element having a first face, a second face opposite to said first face, and a side face extending between said first and said second faces, an electrode provided on said first face, and a conductive lead having a first and a second end opposite to each other, said first end being conductively connected to said electrode, said second end being noncondutively connected to said second surface, said lead extending to face said side face, said circuit board having a principal board surface, said mounting structure comprising:
A method of manufacturing a semiconductor package, comprising the steps of:
Dependencies are inferred from the claim text.