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US 2002/0001699 A1Published application
Manufacturing method of printed circuit board
AssigneeVictor Company of Japan, Ltd.
InventorsYasuaki Seki, Shigenori Shiratori, Kenji Suzuki
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Abstract
In a manufacturing method of a printed circuit board comprising a process of coating insulative resin on a surface of a printed circuit board having a blind hole and a process of filling up the insulative resin in the blind hole, the printed circuit board coated with the insulative resin is kept in a low pressure atmosphere of 1.3 to 666 hPa, and then the insulative resin is hardened, so that the insulative resin is filled up in the blind hole appropriately.
Claims4
A manufacturing method of a printed circuit board comprising steps of:
- coating insulative resin on a surface of a printed circuit board having a blind hole;
- filling up the insulative resin in the blind hole;
- keeping the printed circuit board coated with the insulative resin in a low pressure atmosphere of 1.3 to 666 hPa;
- and
- hardening the insulative resin,
- wherein said blind hole is filled up with the insulative resin.
3 more elements
Dependencies are inferred from the claim text.