Sheet resin composition and process for manufacturing semiconductor device therewith
AssigneesAmkor Technology, Inc., Nitto Denko Corporation
InventorsHirotaka Ueda, Masaki Mizutani
Life of this patent
Estimating the term…
Abstract
A sheet resin composition is adhered to a silicon wafer. The sheet resin composition supports the silicon wafer during back grinding and dicing into chips. Further, the sheet resin composition interfacial underfills between a chip from the wafer and a substrate during subsequent fabrication of a semiconductor device, the chip being flip chip mounted to the substrate.
Claims59
A sheet resin composition comprising a resin composition capable of adhering to a silicon wafer, usable for supporting said silicon wafer during back grinding and interfacial underfilling between a chip and a substrate.
A process for manufacturing a semiconductor device comprising:
- adhering onto a silicon wafer a sheet resin composition to support said silicon wafer;
- subjecting said silicon wafer to back grinding;
- and
- underfilling an interface between a chip and a substrate with said sheet resin composition as an underfilling material.
A sheet resin composition having a melt viscosity at 150° to 200° C. from 0.01 to 1000 Pa[Circlesolid]s, a gelation time at 150° C. from 0.1 to 10 minutes, and a viscosity at a pasting temperature of from 20° to 150° C. from 10 to 1010 Pa[Circlesolid]s consisting essentially of:
- a thermosetting resin composition;
- a curing agent;
- and
- an inorganic filler.
A structure comprising:
- a sheet resin composition having a melt viscosity at 150° to 200° C. from 0.01 to 1000 Pa[Circlesolid]s, a gelation time at 150° C. from 0.1 to 10 minutes, and a viscosity at a pasting temperature of from 20° to 150° C. from 10 to 1010 Pa[Circlesolid]s consisting essentially of:
- a thermosetting resin composition;
- a curing agent;
- and
- an inorganic filler, and
- a releasing film for protecting a surface of said sheet resin composition and for reinforcing said sheet resin composition.
A method of forming a sheet resin composition comprising:
- mixing and melting an epoxy resin composition selected from the group consisting of a cresol novolak epoxy resin, a biphenyl epoxy resin, a bisphenol A epoxy resin, and a bisphenol F epoxy resin with a curing agent selected from the group consisting of a phenolic resin and an acid anhydride to form a molten resin mix;
- mixing said molten resin mix with an inorganic filler selected from the group consisting of silica powder, alumina, silicon nitride, manganese oxide, calcium carbonate, and titanium white to form an inorganic filler containing resin mix;
- mixing said inorganic filler containing resin mix with a catalyst selected from the group consisting of triphenylphosphine, 2-methylimidazole, DBU (1,8-diazabicyclo(5.4.0)undecene-7), DBN (1,5-diazabicyclo(4.3.0)nonene-5), and 4P4B (tetraphenylphosphonium tetraphenyl borate) to form a resin composition;
- and
- processing said resin composition into a shape of a sheet or tape to form said sheet resin composition.
A method of fabricating a semiconductor device comprising:
- coupling a sheet resin composition to an active surface of a wafer comprising bumps formed thereon;
- back-grinding said wafer;
- dicing said wafer to form a chip having said sheet resin composition coupled thereto;
- coupling said sheet resin composition to a substrate;
- and
- thermally melting and curing said sheet resin composition to underfill an interface between said chip and said substrate.
A method of fabricating a semiconductor device comprising:
- coupling a dicing tape to a back side of a wafer;
- half-cutting said wafer;
- coupling a sheet resin composition to an active surface of said wafer having bumps formed thereon;
- peeling off said dicing tape on said back side of said wafer;
- back-grinding and cutting said wafer to form a chip;
- dicing said sheet resin composition from said back side of said wafer;
- mounting said sheet resin composition directly to a substrate;
- and
- thermally melting and curing said sheet resin composition to underfill an interface between said chip and said substrate.
A semiconductor device comprising:
- a chip;
- a substrate;
- and
- a sheet resin composition underfilling an interface between said chip and said substrate, said sheet resin composition having a melt viscosity at 150° to 200° C. from 0.01 to 1000 Pa[Circlesolid]s, a gelation time at 150° C. from 0.1 to 10 minutes, and a viscosity at a pasting temperature of from 20° to 150° C. from 10 to 1010 Pa[Circlesolid]s consisting essentially of:
- a thermosetting resin composition;
- a curing agent;
- and
- an inorganic filler.
A semiconductor device comprising:
- a chip;
- a substrate;
- and
- a means for underfilling an interface between said chip and said substrate, said means for underfilling supporting a wafer during dicing to form said chip.
Dependencies are inferred from the claim text.