Semiconductor memory device permitting improved integration density and reduced accessing time
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsHIROSHI KATO, TSUKASA OOISHI, HIDETO HIDAKA
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AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsHIROSHI KATO, TSUKASA OOISHI, HIDETO HIDAKA
Estimating the term…
A sub-amplifier includes first and second transistors which each receive the potential of a sub-I/O line pair at each gate, a third transistor controlled by a signal transmitted in the memory cell column-direction and coupling the sources of the first and second transistors and a ground potential, and fourth and fifth transistors controlled by a signal transmitted in the memory cell row-direction and coupling the drains of the first and second transistors and a main I/O line pair. Since the sub-amplifier is controlled by a signal transmitted in the column-direction, the influence of skew with a column selecting signal can be reduced.
A semiconductor memory device, comprising:
A semiconductor memory device, comprising:
A semiconductor memory device, comprising:
Dependencies are inferred from the claim text.