Semiconductor device and process for manufacturing the same

A process for manufacturing a memory module, comprising:

• the step of preparing a semiconductor device for selecting a word structure on the basis of a word structure switching signal, as inputted to word structure switching external terminals, and for selecting a function on the basis of a function switching signal, as inputted to function switching external terminals, function switching means for selecting an arbitrary function switching signal, as inputted to said function switching external terminals by mounting conducting means or not, and a plurality of kinds of dedicated printed-wiring substrates corresponding to a plurality of word structures, and selecting one of said dedicated printed-wiring substrates, as corresponding to a demanded word structure of said semiconductor device, from said plurality of kinds of dedicated printed-wiring substrates;
• the step of mounting said semiconductor device on the selected one of said dedicated printed-wiring substrates;
• and
• the step of selecting an arbitrary function selectively, with or without said conducting means provided.

A memory module comprising:

• a wiring substrate having arranged lines;
• a semiconductor device;
• and
• a function switching circuit,
• wherein said semiconductor device includes function switching terminals for selecting an internal function and mounted on said wiring substrate, and
• wherein said function switching circuit is electrically connected with the function switching terminals of said semiconductor device and is arranged on said wiring substrate.

A memory module comprising:

• a wiring substrate having arranged lines;
• a semiconductor device;
• a function switching circuit;
• and
• word structure setting lines,
• wherein said semiconductor device includes function switching terminals for switching an internal function and mounted on said wiring substrate, and word structure switching terminals for selecting a word structure, and
• wherein said function switching circuit is electrically connected with the function switching terminals of said semiconductor device and is arranged on said wiring substrate.

A memory module comprising:

• a wiring substrate having interconnections;
• a semiconductor device;
• a function switching circuit;
• and
• word structure switching lines,
• wherein said semiconductor device includes function switching terminals for selecting an internal function and mounted on said wiring substrate, and word structure switching terminals for selecting a word structure,
• wherein said function switching circuit is connected with the function switching terminals of said semiconductor device and is arranged on said wiring substrate, and
• wherein said word structure switching circuit is electrically connected with said word structure switching terminals and arranged on said wiring substrate.

A memory module comprising:

• a wiring substrate having interconnections;
• a semiconductor device;
• a function setting circuit;
• and
• a word structure setting circuit,
• wherein said semiconductor device includes function switching terminals for selecting a function and mounted on said wiring substrate, and word structure switching terminals for selecting a word structure,
• wherein said function setting circuit is connected with the function switching terminals of said semiconductor device and is arranged on said wiring substrate, and
• wherein said word structure setting circuit is electrically connected with said word structure switching terminals and arranged on said wiring substrate.