Bonding over integrated circuits
AssigneeTexas Instruments Incorporated
InventorsEDGAR R. ZUNIGA, SAMUEL A. CIANI
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Abstract
An architecture and method of fabrication for an integrated circuit having a bond pad; at lest one portion of said integrated circuit disposed under said contact pad and electrically connected to said pad through a via; a combination of a bondable metal layer, a stress-absorbing metal layer, and a mechanically strengthened, electrically insulating layer; and said combination of layers separating said contact pad and said portion of said integrated circuit, and having sufficient thickness to protect said circuit from bonding impact.
Claims20
An integrated circuit comprising:
- a contact pad;
- at least one portion of said integrated circuit disposed under said contact pad and electrically connected to said pad through a via;
- a combination of a bondable metal layer, a stress-absorbing metal layer, and a mechanically strengthened, electrically insulating layer;
- and
- said combination of layers separating said contact pad and said portion of said integrated circuit, and having sufficient thickness to protect said circuit from bonding impact.
A method for fabricating an integrated circuit having a contact pad positioned over a portion of said integrated circuit comprising the steps of:
- depositing a mechanically strengthened, electrically insulating layer overcoating said integrated circuit;
- opening a via through said insulating layer;
- depositing a layer of stress-absorbing metal over said insulating layer, filling said via therein;
- depositing a layer of bondable metal over said layer of stress-absorbing metal;
- and
- patterning said bondable metal layer and said stress-absorbing metal layer such that at least a portion of the remaining layers form a contact pad positioned over said integrated circuit.
Dependencies are inferred from the claim text.