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US 2002/0000630 A1Published application
Plastic package for micromechanical devices
AssigneeTexas Instruments Incorporated
InventorAnthony L. Coyle
Life of this patent
Estimating the term…
Abstract
Low-cost plastic cavity-up land-grid array packages and ball-grid array packages are provided, suitable for wire-bonded chips having micromechanical components. The packages feature a thermal heat spreader and a protective lid. The package structure disclosed is flexible with regard to materials and geometrical detail, and provides solutions to specific functions such as storage space for chemical compounds within the enclosed cavity of the package.
Claims12
A packaged micromechanical device, comprising:
- a semiconductor chip having an integrated circuit including a plurality of micromechanical components configured in a plane in the central portion of said chip, and a plurality of bonding pads disposed in peripheral portions of said chip;
- a support having central and peripheral areas, said chip adhered to said central area;
- a laminated plastic substrate having at least two layers which form an opening, first and second surfaces, and a plurality of electrically conductive routing lines integral with said layers;
- said second surface adhered to said peripheral area of said support such that one level of said opening is closed;
- a plurality of terminals disposed on said second surface, at least one of said terminals electrically connected to at least one of said routing lines;
- said first surface being flat and in a plane parallel to said plane of said components;
- coupling members electrically connecting at least one of said bonding pads to at least one of said routing lines;
- and
- a lid adhered to said first surface in a plane parallel to said plane of said components, whereby a second level of said opening is closed.
6 more elements
Dependencies are inferred from the claim text.