Method and apparatus for estimating quality of lead-free solder material and process and system for flow soldering

An apparatus for estimating a quality of a lead-free solder material which is used for a flow soldering process such that the quality of the lead-free solder material is estimated based on a differential thermal analysis curve of a sample of the lead-free solder material relatively to a reference material obtained by a differential thermal analysis method.

A process for flow soldering using a lead-free solder material, which process comprises:

• obtaining a sample of the lead-free solder material in a solder bath of a flow soldering apparatus;
• and
• obtaining a differential thermal analysis curve of the sample of the lead-free solder material relatively to a reference material by utilizing a differential thermal analysis method, and thereby estimating the quality of the lead-free solder material based on the differential thermal analysis curve.

A system for flow soldering using a lead-free solder material, which system comprises:

• a flow soldering apparatus including a solder bath which contains a lead-free solder material;
• and
• a quality estimation apparatus for estimating a quality of the lead-free solder material such that the quality of the lead-free solder material in the solder bath is estimated based on a differential thermal analysis curve of a sample of the lead-free solder material relatively to a reference material obtained by a differential thermal analysis method.