Heat treatment apparatus and substrate processing system
AssigneeTokyo Electron Limited
InventorsEiichi Shirakawa, Nobuyuki Sata
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AssigneeTokyo Electron Limited
InventorsEiichi Shirakawa, Nobuyuki Sata
Estimating the term…
The heat treatment apparatus of the present invention comprises a chamber, a hot plate for supporting and heating a substrate in a chamber, a gas supply mechanism having a single or a plurality of gas blow-out ports and arranged in an upper space above the hot plate in the chamber, for supplying a gas along the substrate so as to cover the substrate placed on the hot plate, and an exhaust mechanism having a single or a plurality of gas converge/exhaust ports which face the gas blow-out ports with the hot plate interposed therebetween, for converging and exhausting the gas blown out from the gas blow-out ports, from the chamber, the gas converge/exhaust ports having an effective exhaustion opening length L2 which is shorter than an effective blow-out opening length L1.
A heat treatment apparatus comprising:
An heat treatment apparatus comprising:
A heat treatment apparatus comprising:
An heat treatment apparatus comprising:
A substrate processing system comprising:
Dependencies are inferred from the claim text.