Loading patent…
AssigneeRicoh Microelectronics Co., Ltd.
InventorMAKOTO KINOSHITA
Estimating the term…
An intaglio printing method and an intaglio printer are proposed, which are suitable for forming a wiring pattern and/or bumps such as bump electrodes on a print receiving material on which printing is to be performed, such as a substrate and a semiconductor package, using a paste or a fused metal. In addition, a method of forming the wiring pattern and the bumps such as bump electrodes on the printing substrate, using the intaglio printing method, a method for forming a wiring pattern, an apparatus for carrying out the method of forming the wiring pattern, the bump electrode and the wiring pattern are proposed.
An intaglio printing method comprising the steps of (a) bringing an intaglio printing master having portions depressed in a printing shape below the surface of said printing master, in which depressed portions a paste or a fused metal is filled, into close contact with a print receiving material which can receive said paste or said fused metal, and (b) separating said intaglio printing master from said print receiving material to transfer said paste or said fused metal to said print receiving material, wherein said intaglio printing method further comprises the steps of:
An intaglio printer capable of (a) bringing an intaglio printing master having portions depressed in a printing shape below the surface of said printing master, in which depressed portions a paste or a fused metal is filled, into close contact with a print receiving material which can receive said paste or said fused metal, and (b) separating said intaglio printing master from said print receiving material to transfer said paste or said fused metal to said print receiving material, comprising:
A method of forming bumps on a substrate, using an intaglio printing master having bump female die portions in a printing shape depressed below the surface of said printing master, by an intaglio printing method comprising the steps of (a) bringing said intaglio printing master, with a paste or a fused metal being filled in said bump female die portions, into close contact with a print receiving material which can receive said paste or said fused metal, and (b) separating said intaglio printing master from said print receiving material to transfer said paste or said fused metal to said print receiving material, wherein said intaglio printing method further comprises the steps of:
A method of forming a wiring pattern on a substrate, using an intaglio printing master having groove portions depressed below the surface of said printing master, in a printing shape corresponding to said wiring pattern, by an intaglio printing method comprising the steps of (a) bringing said intaglio printing master, with a paste or a fused metal being filled in said groove portions, into close contact with a print receiving material which can receive said paste or said fused metal, and (b) separating said intaglio printing master from said print receiving material to transfer said paste or said fused metal to said print receiving material, wherein said intaglio printing method further comprises the steps of:
A method of forming bumps and/or a wiring pattern on a substrate, using an intaglio printing master having bump female die portions and/or groove portions corresponding to said wiring pattern, each in a printing shape, depressed below the surface of said printing master, by an intaglio printing method comprising the steps of (a) bringing said intaglio printing master, with a paste or a fused metal being filled in said bump female die portions and/or said groove portions, into close contact with a print receiving material, and (b) separating said intaglio printing master from said print receiving material to transfer said paste or said fused metal to said print receiving material, wherein said intaglio printing method further comprises the steps of:
A method of forming bumps and/or a wiring pattern on a printed circuit board in a superimposed manner, using an intaglio printing master having bump female die portions and/or groove portions corresponding to said wiring pattern, each in a printing shape, depressed below the surface of said printing master, by an intaglio printing method comprising the steps of (a) bringing said intaglio printing master, with a paste or a fused metal being filled in said bump female die portions and/or said groove portions, into close contact with a print receiving material, and (b) separating said intaglio printing master from said print receiving material to transfer said paste or said fused metal to said print receiving material, wherein said intaglio printing method further comprises the steps of:
A method of forming a wiring pattern on a front or back side of a printed circuit board and/or on a resist-coated substrate and forming a junction portion and/or a crossover portion of said wiring pattern, using an intaglio printing master having groove portions depressed below the surface of said printing master, in a printing shape corresponding to said wiring pattern, by an intaglio printing method comprising the steps of (a) bringing said intaglio printing master, with a paste or a fused metal being filled in said groove portions, into close contact with a print receiving material, and (b) separating said intaglio printing master from said print receiving material to transfer said paste or said fused metal to said print receiving material, wherein said intaglio printing method further comprises the steps of:
An apparatus for forming bumps and/or a wiring pattern on a substrate, which is capable of (a) bringing an intaglio printing master having bump female die portions and/or groove portions corresponding to said wiring pattern, each in a printing shape, depressed below the surface of said printing master, in which bump female die portions and/or said groove portions a paste or a fused metal is filled, into close contact with a print receiving material, and (b) separating said intaglio printing master from said print receiving material to transfer said paste or said fused metal in said printing shape to said print receiving material, comprising;
A bump electrode comprising a bump made from a fused metal in the shape of a circular cylinder, a cone or pyramide or a frustum of a cone or pyramid, formed on a substrate.
A printed circuit board comprising a substrate and a wiring pattern provided thereon which is made from a paste or a fused metal, having a cross-section at right angles with respect to the extending direction of said wiring pattern with such an aspect ratio of the depth thereof to the width thereof that the depth thereof is greater than and the width thereof is smaller than the respective depth and width of an aspect ratio of 1:5.
A printed circuit board comprising:
An intaglio printing method comprising the steps of (a) bringing an intaglio printing master having portions depressed in a printing shape below the surface of said printing master, in which depressed portions a paste or a fused metal is filled, into close contact with a print receiving material, and (b) separating said intaglio printing master from said print receiving material to transfer said paste or said fused metal in said printing shape to said print receiving material, wherein said intaglio printing master having said depressed portions is made of a plastic material.
An intaglio printer capable of (a) bringing an intaglio printing master having portions depressed in a printing shape below the surface of said printing master, in which depressed portions a paste or a fused metal is filled, into close contact with a print receiving material, and (b) separating said intaglio printing master from said print receiving material to transfer said paste or said fused metal to said print receiving material, wherein said intaglio printing master having said depressed portions is made of a plastic material.
Dependencies are inferred from the claim text.