Method and apparatus for mounting semiconductor chips onto a flexible substrate
AssigneeESEC Trading SA
InventorRene Josef Ulrich
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Abstract
The mounting of semiconductor chips onto a flexible substrate takes place in three steps: Firstly, at a dispensing station, adhesive is applied to predetermined substrate sites on the substrate. Then, at a bonding station, semiconductor chips are placed onto the substrate sites. Finally, curing of the adhesive takes place. In accordance with the invention, the substrate is fixed onto a level support surface by means of vacuum during the hardening of the adhesive.
Claims6
A method for mounting semiconductor chips onto a flexible substrate, whereby at a dispensing station adhesive is applied to predetermined substrate sites on a substrate, whereby at a bonding station the semiconductor chips are placed on the substrate sites and whereby in a curing station the adhesive is cured, wherein during curing of the adhesive, the substrate is fixed onto an even support surface by means of vacuum.
An apparatus for mounting semiconductor chips onto a flexible substrate, comprising:
- a dispensing station for applying adhesive to a substrate;
- a bonding station for equipping the substrate with semiconductor chips, and
- a heating plate arranged after the bonding station in a transport direction of the substrate which has channels to which vacuum can be applied for sucking down the substrate.
Dependencies are inferred from the claim text.