Remote plasma apparatus for processing sustrate with two types of gases

A remote plasma apparatus comprising

• a body defining a cavity and having first and second inlets and an inner side wall, the cavity comprising a plasma generation region and a processing region, the first inlet communicating with the plasma generation region to introduce a first gas into the plasma generation region, the second inlet communicating with the processing region to supply a second gas into the processing region;
• an energy source arranged and adapted to apply energy within the plasma generation region to generate, from the first gas, plasma including radicals;
• a plate arranged between the plasma generation region and the processing region with no gap left between the plate and the inner side wall, the plate being formed with a plurality of perforated holes which the radicals pass through, wherein aperture ratio of the perforated holes to the plate is not greater than five percent;
• and
• a substrate supporter arranged within the processing region and adapted to support a substrate to be processed by using a reaction between the radicals passing through the perforated holes and the second gas supplied through the second inlet.

A remote plasma apparatus comprising:

• a body defining a cavity and having first and second inlets, the cavity comprising a plasma generation region and a processing region, the first inlet communicating with the plasma generation region to introduce a first gas into the plasma generation region, the second inlet communicating with the processing region to supply a second gas into the processing region;
• an energy source arranged and adapted to apply energy within the plasma generation region to generate, from the first gas, plasma including radicals;
• a plate arranged between the plasma generation region and the processing region, the plate being formed with a plurality of perforated holes which the radicals pass through arid each of which has a diameter not larger than three millimeter, wherein aperture ratio of the perforated holes to the plate is not greater than five percent;
• and
• a substrate supporter arranged within the processing region and adapted to support a substrate to be processed by using a reaction between the radicals passing through the perforated holes and the second gas supplied through the second inlet.

A remote plasma apparatus comprising:

• a body defining a cavity and having first and second inlets and inner side wall, the cavity comprising a plasma generation region and a processing region, the first inlet communicating with the plasma generation region to introduce a first gas into the plasma generation region, the second inlet communicating with the processing region to supply a second gas into the processing region;
• an energy source arranged and adapted to apply energy within the plasma generation region to generate, from the first gas, plasma including radicals;
• a plate arranged between the plasma generation region and the processing region with no gap left between the plate and the inner side wall, the plate being formed with a plurality of perforated holes which the radicals pass through and each of which has a diameter not larger than three millimeter, wherein aperture ratio of the perforated holes to the plate is not greater than five percent;
• and
• a substrate supporter arranged within the processing region and adapted to support a substrate to be processed by using a reaction between the radicals passing through the perforated holes and the second gas supplied through the second inlet.

A remote plasma apparatus comprising:

• a body defining a cavity and having first and second inlets, the cavity comprising a plasma generation region and a processing region, the first inlet communicating with the plasma generation region to introduce a first gas into the plasma generation region, the second inlet communicating with the processing region to supply a second gas into the processing region;
• an energy source arranged and adapted to apply energy within the plasma generation region to generate, from the first gas, plasma including radicals;
• a closure electrode arranged within the cavity and defining the plasma generation region in cooperation with the body, the closure electrode being electrically grounded to allow the radicals to pass through the closure electrode;
• a plate arranged within the cavity and defining the processing region in cooperation with the body, the plate being formed with a plurality of perforated holes which the radicals pass through, wherein aperture ratio of the perforated holes to the plate is not greater than five percent;
• and
• a substrate supporter arranged within the processing region and adapted to support a substrate to be processed by using a reaction between the radicals passing through the perforated holes and the second gas supplied through the second inlet.

A remote plasma apparatus comprising:

• a body defining a cavity and having first and second inlets and an inner side wall, the cavity comprising a plasma generation region and a processing region, the first inlet communicating with the plasma generation region to introduce a first gas into the plasma generation region, the second inlet communicating with the processing region to supply a second gas into the processing region;
• an energy source arranged and adapted to apply energy within the plasma generation region to generate, from the first gas, plasma including radicals;
• a closure electrode arranged within the cavity and defining the plasma generation region in cooperation with the body, the closure electrode being electrically grounded to allow the radicals to pass through the closure electrode;
• a plate arranged within the cavity with no gap left between the plate and the inner side wall so as to define the processing region, the plate being formed with a plurality of perforated holes which the radicals pass through, wherein aperture ratio of the perforated holes to the plate is not greater than five percent;
• and
• a substrate supporter arranged within the processing region and adapted to support a substrate to be processed by using a reaction between the radicals passing through the perforated holes and the second gas supplied through the second inlet.

A remote plasma apparatus comprising:

• a body defining a cavity and having first and second inlets, the cavity comprising a plasma generation region and a processing region, the first inlet communicating with the plasma generation region to introduce a first gas into the plasma generation region, the second inlet communicating with the processing region to supply a second gas into the processing region;
• an energy source arranged and adapted to apply energy within the plasma generation region to generate, from the first gas, plasma including radicals;
• a closure electrode arranged within the cavity and defining the plasma generation region in cooperation with the body, the closure electrode being electrically grounded to allow the radicals to pass through the closure electrode;
• a plate arranged within the cavity and defining the processing region in cooperation with the body, the plate being formed with a plurality of perforated holes which the radicals pass through and each of which has a diameter not larger than three millimeter, wherein aperture ratio of the perforated holes to the plate is not greater than five percent;
• and
• a substrate supporter arranged within the processing region and adapted to support a substrate to be processed by using a reaction between the radicals passing through the perforated holes and the second gas supplied through the second inlet.

A remote plasma apparatus comprising

• a body defining a cavity and having first and second inlets and inner side wall, the cavity comprising a plasma generation region and a processing region, the first inlet communicating with the plasma generation region to introduce a first gas into the plasma generation region, the second inlet communicating with the processing region to supply a second gas into the processing region;
• an energy source arranged and adapted to apply energy within the plasma generation region to generate, from the first gas, plasma including radicals;
• a closure electrode arranged within the cavity and defining the plasma generation region in cooperation with the body, the closure electrode being electrically grounded to allow the radicals to pass through the closure electrode;
• a plate arranged within the cavity with no gap left between the plate and the inner side wall so as to define the processing region, the plate being formed with a plurality of perforated holes which the radicals pass through and each of which has a diameter not larger than three millimeter, wherein aperture ratio of the perforated holes to the plate is not greater than five percent;
• and
• a substrate supporter arranged within the processing region and adapted to support a substrate to be processed by using a reaction between the radicals passing through the perforated holes and the second gas supplied through the second inlet.

A remote plasma apparatus comprising:

• a body defining a cavity and having first and second inlets, the cavity comprising a plasma generation region and a processing region, the first inlet communicating with the plasma generation region to introduce a first gas into the plasma generation region, the second inlet communicating with the processing region to supply a second gas into the processing region;
• an energy source arranged and adapted to apply energy within the plasma generation region to generate, from the first gas, plasma including radicals;
• a plate arranged between the plasma generation region and the processing region, the plate being electrically grounded, the plate being formed with a plurality of perforated holes which the radicals pass through, wherein aperture ratio of the perforated holes to the plate is not greater than five percent;
• and
• a substrate supporter arranged within the processing region and adapted to support a substrate to be processed by using a reaction between the radicals passing through the perforated holes and the second gas supplied through the second inlet.

A remote plasma apparatus comprising:

• a body defining a cavity and having first and second inlets and an inner side wall, the cavity comprising a plasma generation region and a processing region, the first inlet communicating with the plasma generation region to introduce a first gas into the plasma generation region, the second inlet communicating with the processing region to supply a second gas into the processing region;
• an energy source arranged and adapted to apply energy within the plasma generation region to generate, from the first gas, plasma including radicals;
• a plate arranged between the plasma generation region and the processing region with no gap left between the plate and the inner side wall, the plate being electrically grounded, the plate being formed with a plurality of perforated holes which the radicals pass through, wherein aperture ratio of the perforated holes to the plate is not greater than five percent;
• and
• a substrate supporter arranged within the processing region and adapted to support a substrate to be processed by using a reaction between the radicals passing through the perforated holes and the second gas supplied through the second inlet.

A remote plasma apparatus comprising:

• a body defining a cavity and having first and second inlets, the cavity comprising a plasma generation region and a processing region, the first inlet communicating with the plasma generation region to introduce a first gas into the plasma generation region, the second inlet communicating with the processing region to supply a second gas into the processing region;
• an energy source arranged and adapted to apply energy within the plasma generation region to generate, from the first gas, plasma including radicals;
• a plate arranged between the plasma generation region and the processing region, the plate being electrically grounded, the plate being formed with a plurality of perforated holes which the radicals pass through and each of which has a diameter not larger than three millimeter, wherein aperture ratio of the perforated holes to the plate is not greater than five percent;
• and
• a substrate supporter arranged within the processing region and adapted to support a substrate to be processed by using a reaction between the radicals passing through the perforated holes and the second gas supplied through the second inlet.

A remote plasma apparatus comprising:

• a body defining a cavity and having first and second inlets and inner side wall, the cavity comprising a plasma generation region and a processing region, the first inlet communicating with the plasma generation region to introduce a first gas into the plasma generation region, the second inlet communicating with the processing region to introduce a second gas into the processing region;
• an energy source arranged and adapted to apply energy within the plasma generation region to generate, from the first gas, plasma including radicals;
• a plate arranged between the plasma generation region and the processing region with no gap left between the plate and the inner side wall, the plate being electrically grounded, the plate being formed with a plurality of perforated holes which the radicals pass through and each of which has a diameter not larger than three millimeter, wherein aperture ratio of the perforated holes to the plate is not greater than five percent;
• and
• a substrate supporter arranged within the processing region and adapted to support a substrate to be processed by using a reaction between the radicals passing through the perforated holes and the second gas supplied through the second inlet.

A remote plasma apparatus comprising:

• a body defining a cavity and having first and second inlets, the cavity comprising a plasma generation region and a processing region, the first inlet communicating with the plasma generation region to introduce a first gas into the plasma generation region, the second inlet communicating with the processing region to supply a second gas into the processing region;
• an energy source arranged and adapted to apply energy within the plasma generation region to generate, from the first gas, plasma including radicals;
• a plate arranged between the plasma generation region and the processing region, the plate being formed with a plurality of perforated holes which the radicals pass through, wherein aperture ratio of the perforated holes to the plate is not greater than five percent and wherein neighboring ones of the perforated holes have a predetermined interval therebetween;
• and
• a substrate supporter arranged within the processing region and adapted to support a substrate to be processed by using a reaction between the radicals passing through the perforated holes and the second gas supplied through the second inlet, so that the predetermined interval is shorter than another interval between the plate and the substrate to be processed when the substrate is supported by the substrate supporter.

A remote plasma apparatus comprising:

• a body defining a cavity and having first and second inlets and an inner side wail, the cavity comprising a plasma generation region and a processing region, the first inlet communicating with the plasma generation region to introduce a first gas into the plasma generation region, the second inlet communicating with the processing region to supply a second gas into the processing region;
• an energy source arranged and adapted to apply energy within the plasma generation region to generate, from the first gas, plasma including radicals;
• a plate arranged between the plasma generation region and the processing region with no gap left between the plate and the inner side wall, the plate being formed with a plurality of perforated holes which the radicals pass through, wherein aperture ratio of the perforated holes to the plate is not greater than five percent and wherein neighboring ones of the perforated holes have a predetermined interval therebetween;
• and
• a substrate supporter arranged within the processing region and adapted to support a substrate to be processed by using a reaction between the radicals passing through the perforated holes and the second gas supplied through the second inlet, so that the predetermined interval is shorter than another interval between the plate and the substrate to be processed when the substrate is supported by the substrate supporter.

A remote plasma apparatus comprising:

• a body defining a cavity and having first and second inlets, the cavity comprising a plasma generation region and a processing region, the first inlet communicating with the plasma generation region to introduce a first gas into the plasma generation region, the second inlet communicating with the processing region to supply a second gas into the processing region;
• an energy source arranged and adapted to apply energy within the plasma generation region to generate, from the first gas, plasma including radicals;
• a plate arranged between the plasma generation region and the processing region, the plate being formed with a plurality of perforated holes which the radicals pass through and each of which has a diameter not larger than three millimeter, wherein aperture ratio of the perforated holes to the plate is not greater than five percent and wherein neighboring ones of the perforated holes have a predetermined interval therebetween;
• and
• a substrate supporter arranged within the processing region and adapted to support a substrate to be processed by using a reaction between the radicals passing through the perforated holes and the second gas supplied through the second inlet, so that the predetermined interval is shorter than another interval between the plate and the substrate to be processed when the substrate is supported by the substrate supporter.

A remote plasma apparatus comprising:

• a body defining a cavity and having first and second inlets and inner side wall, the cavity comprising a plasma generation region and a processing region, the first inlet communicating with the plasma generation region to introduce a first gas into the plasma generation region, the second inlet communicating with the processing region to supply a second gas into the processing region;
• an energy source arranged and adapted to apply energy within the plasma generation region to generate, from the first gas, plasma including radicals;
• a plate arranged between the plasma generation region and the processing region with no gap left between the plate and the inner side wall, the plate being formed with a plurality of perforated holes which the radicals pass through and each of which has a diameter not larger than three millimeter, wherein aperture ratio of the perforated holes to the plate is not greater than five percent and wherein neighboring ones of the perforated holes have a predetermined interval therebetween;
• and
• a substrate supporter arranged within the processing region and adapted to support a substrate to be processed by using a reaction between the radicals passing through the perforated holes and the second gas supplied through the second inlet, so that the predetermined interval is shorter than another interval between the plate and the substrate to be processed when the substrate is supported by the substrate supporter.

A remote plasma apparatus comprising:

• a body defining a cavity and having first and second inlets and first and second outlets, the cavity comprising a plasma generation region and a processing region, the first inlet communicating with the plasma generation region to introduce a first gas into the plasma generation region, the second inlet communicating with the processing region to supply a second gas into the processing region, the first and the second outlets communicating between an outside of the remote plasma apparatus and the plasma generation region and the processing region, respectively;
• an energy source arranged and adapted to apply energy within the plasma generation region to generate, from the first gas, plasma including radicals;
• a plate arranged between the plasma generation region and the processing region, the plate being formed with a plurality of perforated holes which the radicals pass through, wherein aperture ratio of the perforated holes to the plate is not greater than five percent;
• and
• a substrate supporter arranged within the processing region and adapted to support a substrate to be processed by using a reaction between the radicals passing through the perforated holes and the second gas supplied through the second inlet.

A remote plasma apparatus comprising;

• a body defining a cavity and having first and second inlets, the cavity comprising a plasma generation region and a processing region, the first inlet communicating with the plasma generation region to introduce a first gas into the plasma generation region, the second inlet being adapted to supply a second gas into the processing region;
• an energy source arranged and adapted to apply energy within the plasma generation region to generate, from the first gas, plasma including radicals;
• a plate arranged between the plasma generation region and the processing region and comprising, to define a gas supplier plenum, a top portion having a plurality of upper holes, a bottom portion having a plurality of lower holes, a plurality of tube walls connecting between the upper holes and the lower holes, respectively, and a plurality of gas injection holes communicating with the processing region, the tube walls forming a plurality of perforated holes which the radicals pass through and separating the gas supplier plenum from insides of the perforated holes, respectively, the gas supplier plenum of the plate being connected to the second inlet so that the second inlet communicates with the processing region through the gas supplier plenum and the gas injection holes, wherein aperture ratio of the perforated holes to the plate is not greater than five percent;
• and
• a substrate supporter arranged within the processing region and adapted to support a substrate to be processed by using a reaction between the radicals passing through the perforated holes and the second gas supplied through the second inlet.