Cleaning method and polishing apparatus employing such cleaning method

An apparatus for polishing and then cleaning a substrate, said apparatus comprising:

• a polishing apparatus for polishing a substrate using an abrasive liquid containing abrasive particles;
• and
• a cleaning apparatus for cleaning a polished surface of the substrate by supplying a cleaning liquid having the same pH as the abrasive liquid or similar pH to the abrasive liquid and then changing the pH of the cleaning liquid toward neutral so that the pH of the abrasive liquid remaining on the polished surface of the substrate after polishing is not rapidly changed.

An apparatus for polishing and then cleaning a substrate, said apparatus comprising:

• a polishing apparatus for polishing a substrate using an abrasive liquid containing abrasive particles;
• and
• a cleaning apparatus for cleaning a polished surface of the substrate by supplying a cleaning liquid having the same pH as the abrasive liquid or similar pH to the abrasive liquid.

An method for polishing and then cleaning a substrate, said method comprising:

• polishing a substrate using an abrasive liquid containing abrasive particles;
• and
• cleaning a polished surface of the substrate by supplying a cleaning liquid comprising electrolytic ionic water and having the same pH as the abrasive liquid or similar pH to the abrasive liquid and then changing the pH of the cleaning liquid toward neutral so that the pH of the abrasive liquid attached to the polished surface of the substrate is not rapidly changed.

An method for polishing and then cleaning a substrate, said method comprising:

• polishing a substrate using an abrasive liquid containing abrasive particles;
• and
• cleaning a polished surface of the substrate by supplying a cleaning liquid comprising electrolytic ionic water and having the same pH as the abrasive liquid or similar pH to the abrasive liquid and then changing the pH of the cleaning liquid toward neutral so that the pH of the abrasive liquid remaining on the polished surface of the substrate after polishing is not rapidly changed.