Wire holding structure
AssigneeYazaki Corporation
InventorsYoshitsugu Sawada, Takuya Hasegawa
Life of this patent
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AssigneeYazaki Corporation
InventorsYoshitsugu Sawada, Takuya Hasegawa
Estimating the term…
In a wire holding structure (20), first wire gripping piece portions (23) for a thick wire, having a relatively wide slot width (A), and second wire gripping piece portions (25) for a thin wire, having a relatively narrow slot width (D), are provided on a wire receiving groove (22) in a wiring board (21), and are disposed adjacent to each other. A gripping piece portion-interconnecting portion (27), interconnecting the wire gripping piece portions, is provided at a region disposed between and below each pair of wire gripping piece portions (23, 25). A centerline between the first wire gripping piece portions (23) and a centerline between the second wire gripping piece portions (25) coincide with a centerline of the wire receiving groove (22).
A wire holding structure, comprising:
A wire holding structure, comprising:
A wire holding structure, comprising:
A wire holding structure, comprising:
Dependencies are inferred from the claim text.