Method for forming gate segments for an integrated circuit
AssigneeMicron Technology, Inc.
InventorWendell P. Noble
Life of this patent
Estimating the term…
Abstract
A method for forming gate segments in an integrated circuit. The method begins by forming a shallow trench isolation region outwardly from a layer of semiconductor material to isolate a plurality of active regions of the integrated circuit. After the isolation region is formed, at least one gate segment is formed in each active region by depositing, planarizing and selectively etching a conductive material. Source/drain regions are also formed in the active region. The active regions are selectively interconnected with edge-defined conductors that pass outwardly from the gate segments and the shallow trench isolation region to form the integrated circuit.
Claims17
A method for forming an integrated circuit, comprising the steps of:
- forming a shallow trench isolation region outwardly from a layer of semiconductor material to isolate a plurality of active regions of the integrated circuit;
- forming at least one gate segment in each active region after forming the shallow trench isolation region;
- forming source/drain regions in the active region;
- and
- selectively interconnecting the active regions with conductors that pass outwardly from the gate segments and the shallow trench isolation region to form the integrated circuit.
A method for forming a memory device, comprising the steps of:
- forming a shallow trench isolation region with a pad that extends outwardly from active regions of a semiconductor material;
- removing the pad outwardly from the active regions;
- forming a thin insulating layer outwardly from the active regions;
- forming a conductive layer outwardly from the insulating layer;
- planarizing the conductive layer such that a working surface of the conductive layer is substantially coplanar with a surface of the shallow trench isolation region;
- selectively removing portions of the conductive layer and the insulating layer from the active regions to form at least one gate segment in each active region;
- forming source/drain regions in the portions of the active regions not covered by the conductive layer;
- interconnecting the gate segments with word lines;
- and
- selectively coupling bit lines and storage capacitors to the source/drain regions to form an array of cells for the memory device.
A memory device, comprising:
- an array of memory cells interconnected with a plurality of bit lines and word lines, wherein each cell includes an activation device with gates formed as segments that are separated by and self-aligned with a shallow trench isolation region;
- an addressing circuit that is coupled to the array of memory cells to allow selective access to the memory cells;
- and
- wherein the word lines comprise sub-lithographic word lines and the gate segments for the activation devices are formed after the shallow trench isolation region and before the source and drain are doped.
A method for forming a gate for an integrated circuit component, comprising the steps of:
- isolating an active region of a layer of semiconductor material;
- depositing a layer of conductive material outwardly from the active region;
- selectively removing portions of the conductive material to form the gate.
Dependencies are inferred from the claim text.