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US 2001/0055189 A1Published application
Electrostatic chucking system, and apparatus and method of manufacturing a semiconductor device using the electrostatic chucking system
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorKimio Hagi
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Abstract
A voltage is applied to an electrode of an electrostatic chuck for chucking a semiconductor substrate, and the application voltage is controlled stepwise by means of a voltage control section. In the electrostatic chucking system, a temperature sensor may be provided for detecting the temperature of the semiconductor substrate held by the electrostatic chuck, wherein a signal output from the temperature sensor is input to the voltage control section to thereby control the applied voltage.
Claims8
An electrostatic chucking system comprising:
- an electrostatic chuck having an electrode for chucking a semiconductor substrate;
- a power supply section for applying a voltage to said electrode;
- and
- a voltage control section for controlling the applied voltage,
- wherein said voltage control section varies and controls the applied voltage stepwise.
2 more elements
Dependencies are inferred from the claim text.