US 2001/0054939 A1 · High-frequency multilayer circuit substrate

Abstract

A high-frequency multilayer circuit substrate having a plurality of circuit layers includes a via hole for connection between the circuit layers, a metal pad, an impedance matching transmission line, rectangular stubs and a signal transmission line. A via hole connecting portion is constructed of the via hole, the rectangular stubs and the impedance matching transmission line. A characteristic impedance of the via hole connecting portion is matched to a characteristic impedance of the signal transmission line by adjusting widths and lengths of the impedance matching transmission line and the rectangular stubs. Thereby, the reflection of the signal wave in the via hole connecting portion is reduced to decrease a transmission loss.

Claims7

Dependent claims

A high-frequency multilayer circuit substrate comprising:

a plurality of circuit layers;
a via hole penetrating the plurality of circuit layers to be connected to each other;
a plane impedance matching circuit connected to the via hole;
and
a signal transmission line connected to the plane impedance matching circuit, wherein
a characteristic impedance of a via hole connecting portion formed by the via hole and the plane impedance matching circuit is matched to a characteristic impedance of the signal transmission line.

3 more elements

Dependencies are inferred from the claim text.

Facts

Application

09/842,768Filed 27 Apr 2001

Priority

JP 2000-12739827 Apr 2000

Published

27 Dec 2001

Term ends

Not estimatedThe source records don’t support an estimate.

Classification7 codes

H01P 3/088
Microstrips; Strip lines: stacked transmission lines
H05K 1/0251
Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance: related to vias or transitions between vias and transmission lines
H05K 2201/09718
Covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095: clearance holes
H05K 2201/09727
Covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095: varying width along a single conductor; Conductors or…

High-frequency multilayer circuit substrate

Life of this patent

High-frequency multilayer circuit substrate

Life of this patent

Abstract

Claims7