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AssigneeShinko Electric Industries Co., Ltd.
InventorsMichio Horiuchi, Takashi Kurihara, Shigeru Mizuno
Estimating the term…
To minimize a size of a semiconductor device and reduce a thickness thereof as well as improve the yield and lower the production cost in the production of a semiconductor package, a multi-layered semiconductor device is provided, wherein a film-like semiconductor package (10) incorporating therein a semiconductor chip (12) is disposed in a package accommodation opening (11a) of a circuit pattern layer to form a circuit board. A plurality of such circuit boards are layered together to electrically connect circuit patterns (13) of the circuit boards with each other via a low melting point metal (14) or lead beam bonding (13b).
A multi-layered semiconductor device characterized in that a film-like semiconductor package incorporating therein a semiconductor chip is disposed in a package accommodation opening of a circuit pattern layer to form a circuit board, and a plurality of such circuit boards are layered together to electrically connect circuit patterns of the respective circuit boards with each other.
A method for producing a multi-layered semiconductor device characterized in that the method comprises the steps of separately testing a film-like semiconductor package including a semiconductor chip therein and a circuit pattern layer having an opening for accommodating the semiconductor package;
A multi-layered semiconductor device formed of a plurality of circuit boards layered together, each circuit board comprising an insulation substrate, a semiconductor chip incorporated in the substrate, a circuit formed on a surface of the substrate and connected to the semiconductor chip, characterized in that a lead extending from the circuit on the circuit board is bonded, in a through-hole provided in the insulation substrate of the circuit board, to a circuit on another circuit board disposed beneath the former circuit board to establish an interlayer connection.
A method for producing a multi-layered semiconductor device formed of a plurality of circuit boards layered together, each comprising an insulation substrate, a semiconductor chip incorporated in the substrate, a circuit formed on a surface of the substrate and connected to the semiconductor chip, characterized in that a lead extending from the circuit on the circuit board is bonded in a through-hole provided in the insulation substrate of the circuit board to a circuit on another circuit board disposed beneath the former circuit board to establish an interlayer connection;
Dependencies are inferred from the claim text.