Microelectronic substrate assembly planarizing machines and methods of mechanical and chemical-mechanical planarization of microelectronic substrate assemblies

A planarizing machine for planarizing microelectronic substrates, comprising:

• a table;
• a fluid container on the table, the fluid container having an inner surface defining a cavity and a rim around at least a portion of the inner surface;
• a flexible, elastic membrane coupled to the rim, the membrane having an interior surface facing the inner surface of the fluid container to define a fluid chamber, and the membrane having an exterior surface facing away from the fluid chamber;
• and
• a planarizing medium bonded to the exterior surface of the membrane, the planarizing medium and the membrane flexing together into the fluid chamber to at least substantially conform to a curvature of a microelectronic substrate pressed against the planarizing medium.

A planarizing machine for planarizing a microelectronic substrate, comprising:

• a table having a surface, a sidewall projecting from the surface to define a depression on the table, and a rim at an end of the sidewall;
• a non-perforated elastic membrane having an interior surface facing the depression and an exterior surface facing away from the depression, and the membrane being coupled to the rim to form a sealed fluid chamber between the depression and the interior surface of the membrane;
• a support fluid filling the fluid chamber;
• and
• a planarizing medium coupled to the membrane, the planarizing medium and the membrane flexing into the fluid chamber against the support fluid to at least substantially conform to a curvature of a microelectronic substrate pressed against the planarizing medium.

A planarizing machine for planarizing a microelectronic substrate, comprising:

• a table having a surface, a sidewall projecting from the surface to define a depression on the table, and a rim at the end of the sidewall;
• an elastic membrane having an interior surface facing the depression and an exterior surface facing away from the depression, and the membrane being coupled to the rim to form a sealed fluid chamber between the depression and the interior surface of the membrane;
• a support fluid filling the fluid chamber;
• and
• a planarizing medium bonded to the membrane, the planarizing medium and the membrane flexing against the support fluid into the fluid chamber to at least substantially conform to a curvature of a microelectronic substrate pressed against the planarizing medium.

A planarizing apparatus for use in a planarizing machine for microelectronic devices, comprising:

• a pad support assembly having a bottom section configured to be attached to a table of the planarizing machine, a sidewall projecting from the bottom section, an elastic membrane coupled to the sidewall to define an enclosed fluid chamber, the bottom section, the sidewall and the elastic membrane being an integral component defining a bladder;
• a support fluid in the fluid chamber;
• and
• a planarizing medium coupled to the elastic membrane, the planarizing medium and the elastic membrane flexing in a local flex zone under a substrate pressed against the planarizing medium to provide at least a substantially uniform pressure distribution across the substrate.

In the fabrication of microelectronic substrates, a method of planarizing a microelectronic substrate, comprising:

• pressing a surface of the substrate against a planarizing surface of a planarizing medium bonded to an elastic membrane, the membrane being attached to a fluid container to define a fluid chamber filled with a support fluid;
• moving at least one of the substrate or the planarizing medium with respect to the other;
• and
• flexing portions of the planarizing medium and the elastic membrane in a local flex zone under the substrate as the substrate moves across the planarizing medium to continuously conform the portions of the planarizing medium in the local flex zone to a global curvature across the substrate.