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AssigneeSeiko Epson Corporation
InventorEIJI MURAMATSU
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It is an object of this invention to provide a method for simply and quickly covering a semiconductor device with a coating resin. In the method for covering a semiconductor device 2 used for a liquid crystal panel 1 with a coating resin, a coating resin 14 being formed as a layer, the coating resin 14 is placed around the semiconductor device 2, and the semiconductor device 2 and its surroundings are covered with the coating resin 14 by curing the coating resin 14 so as to be protected from moisture. The coating resin 14 may be a coating resin which is curable through a chemical reaction by heating or an ultraviolet curing type resin or the like. If the coating resin 14 has a through-hole 16 or concavity so as to receive the semiconductor device 2, the position of the coating resin 14 to the semiconductor device 2 can always be set at a fixed position.
A method for covering a semiconductor device with a coating resin, comprising the steps of:
A coating resin for covering a semiconductor device, wherein said coating resin is formed as a layer.
A liquid crystal display device, comprising one pair of substrates facing each other with liquid crystal enclosed therebetween and a semiconductor device which is directly joined to at least one of said substrates,
Dependencies are inferred from the claim text.