Semiconductor device and method of manufacturing the same
OwnerNaoto Kimurainventor
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Abstract
A semiconductor device is provided with a semiconductor chip. A plurality of electrode pads are arranged in rows running in a first direction on a surface of the semiconductor chip. The semiconductor device is provided with a substrate bonded to the surface, solder balls formed on the substrate, and wires for connecting the solder balls respectively to the corresponding electrode pads. A first slit matching the electrode pads and running in the first direction and a second slit running in a second direction perpendicular to the first direction are provided to the substrate to divide the substrate into at least four regions.
Claims10
A semiconductor device comprising:
- a semiconductor chip which has a plurality of electrode pads arranged in a first direction on a first surface thereof;
- a substrate bonded to said first surface, a first slit matching said electrode pads and extending in said first direction and a second slit extending in a direction perpendicular to said first direction being provided to said substrate, and said substrate being divided into at least four regions;
- solder balls formed on said substrate;
- and
- wires respectively connecting said solder balls and corresponding electrode pads.
A method of manufacturing a semiconductor device comprising the steps of:
- forming first and second slits in each of a plurality of mounting regions of a substrate member, a semiconductor chip being to be mounted on each of said mounting regions, and said first and second slits intersecting perpendicularly each other;
- bonding said semiconductor chips to said substrate member for each of said mounting regions, said semiconductor chip having electrode pads formed in a region matching said first slit;
- and
- dividing said substrate member for each of mounting regions.
Dependencies are inferred from the claim text.