Packages having flash-proof structure and method for manufacturing the same

Abstract

An encapsulated semiconductor packaging device having a flash-proof body comprises the following steps. A lead frame having a die pad and a plurality of leads is provided so that the inner portion of each lead frame is separated from the lateral side of the die pad is be formed as a gap there between. Then, the tape is attached to the bottom surfaces of the die pad and the lead frame so as to seal the bottom opening of gap. A dam bar is formed on inner ends of the leads so as to be tightly attached to each lead and a tape, Therefore, the inner ends of the leads and the dam bar are regarded as a wire bonding area. Furthermore, the dam bar is attached to the leads and the tape below each lead so that the dam bar and the tape is formed as a flash-proof structure. Therefore, after the lead frame is placed into the package mold for forming a package, the encapsulation body having a core-hollowed portion is formed. The top surface of the die pad on the lead frame and the wire bonding area on the leads are exposed within the core-hollowed portion of the encapsulation body. Then, the semiconductor chip is adhered onto the top surface of the die pad and wire bonding to electrically connect the semiconductor chip to the wire bonding area on the lead frame. Finally, a lid is adhered onto the encapsulation body to hermetically seal whole core-hollowed portion of the encapsulation body.

Dependencies are inferred from the claim text.