Semiconductor device, method of manufacturing semiconductor device, resin molding die, and semiconductor manufacturing system

A method of manufacturing a semiconductor device comprising:

• arranging at least a base and a semiconductor element on the base in a cavity of a resin molding die;
• supplying a resin to a resin reservoir in direct contact with the cavity and above the semiconductor element in order to substantially fill the cavity;
• and
• injecting the resin into the cavity from the resin reservoir in order to form a resin seal for encapsulating at least a part of the base and the semiconductor element.

A resin molding die comprising:

• a cavity;
• a resin reservoir in direct contact with the cavity and housing a resin for substantially filling the cavity;
• and
• a pusher injecting the resin into the cavity from the resin reservoir.

A semiconductor manufacturing system comprising:

• a resin molding die which includes a cavity, a resin reservoir in direct contact with the cavity and housing a resin for substantially filling the cavity, and a pusher injecting the resin into the cavity from the resin reservoir;
• a plunger for driving the pusher of the resin molding die;
• a plunger driving unit for driving the plunger;
• and
• a control unit for driving the plunger driving unit.

A semiconductor device comprising:

• a base;
• a semiconductor element arranged on the base;
• and
• a resin seal encapsulating the semiconductor element and having a recess just above the semiconductor element.

A semiconductor device comprising:

• a base;
• a semiconductor element on the base;
• and
• a resin seal encapsulating at least a part of the base and the semiconductor element, and having a protrusion just above the semiconductor element.