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US 2001/0042909 A1Published application
Matched thermal expansion carrier tape assemblage for semiconductor devices
AssigneeTexas Instruments Incorporated
InventorsMichael L. Hayden, Clessie A. Troxtell JR.
Life of this patent
Estimating the term…
Abstract
A carrier and cover tape assemblage for semiconductor devices which maintains integrity through bake temperature of 125 degrees C. is provided by cover and carrier tapes of the same material, such as polycarbonate, and thus having the same thermal properties so that the joining adhesive is placed under minimal stress to cause delamination or distortion.
Claims11
An assemblage for holding, transporting and baking semiconductor devices including the following;
- a carrier tape having an array of recesses,
- a cover tape comprising the same polymer and having the same thermal properties as said carrier tape,
- an adhesive joining said tape components, and a plurality of integrated circuit devices.
A tape assemblage for holding, transporting and baking semiconductor devices including the following;
- a carrier tape having an array of recesses comprising a polycarbonate resin having a heat deflection temperature greater than 125 degrees C.,
- a cover tape in the range of 0.05 to 0.10 mm thickness comprising a polycarbonate resin having the same thermal properties as said carrier tape,
- an adhesive joining said tape components, and a plurality of integrated circuit devices.
Dependencies are inferred from the claim text.