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US 2001/0042897 A1Published application
Copper fuse for integrated circuit
AssigneeUnited Microelectronics Corp.
InventorsWen-Kuan Yeh, Chin-Yung Lin
Life of this patent
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Abstract
A copper fuse structure for integrated circuit employs two copper pads formed over a semiconductor substrate. The two copper pads are electrically insulated by dielectrics. An aluminum line is utilized to cover and electrically connect the two copper pads.
Claims9
A copper fuse for an integrated circuit, comprising:
- at least two copper pads, located on a semiconductor substrate;
- and
- a metal line, one end being electrically connected to one of the two copper pads and the other end being electrically connected to the other of the two copped pads;
- wherein at least the two copper pads and the metal line are used as a fuse.
1 more element
A copper fuse for integrated circuit, comprising:
- two copper pads, formed on a semiconductor substrate, the two copper pads insulated with a dielectrics;
- a metal line having a first end and a second end, formed on the semiconductor substrate, covering the two copper pads wherein the first end is connected to one of the two copper pads and the second end is connected to the other of the two copped pads;
- and
- a passivation layer, formed on the semiconductor substrate and covering the two copper pads
- wherein the two copper pads and the metal line are used as a fuse.
2 more elements
Dependencies are inferred from the claim text.