Center bond flip-chip semiconductor device and method of making it
AssigneeMicron Technology, Inc.
InventorsTongbi Jiang, Alan G. Wood
Life of this patent
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Abstract
A center bond flip-chip device carrier and a method for making and using it are described. The carrier includes a flexible substrate supporting a layer of conductive material and a layer of elastomeric material. At least one pocket is formed in the layer of elastomeric material and sized and shaped to house a solder ball. The solder ball is electrically connected to a die positioned on the layer of elastomeric material and also electrically connected to the layer of conductive material.
Claims24
A flip-chip semiconductor carrier having a core material with a plurality of conductive traces positioned on a flexible substrate, said carrier comprising:
- a die attach material formed on said core material, said die attach material defining a plurality of pockets, each said pocket configured and sized to expose a respective one of said conductive traces.
A flip-chip semiconductor device comprising:
- a die;
- and
- a carrier connected to said die, said carrier comprising:
- a flexible substrate;
- a core material with a plurality of conductive traces positioned on said flexible substrate;
- and
- a die attach material formed on said core material, said die attach material defining a plurality of pockets each of which exposes at least one of said conductive traces.
An electronic system, comprising:
- a processor-based system;
- a semiconductor die in electrical connection with said processor-based system;
- and
- a die carrier connected to said semiconductor die and including a core material with a plurality of conductive traces positioned on a flexible substrate, said carrier comprising:
- a die attach material formed on said layer of conductive material, said die attach material defining a plurality of pockets, each said pocket being adapted to expose at least one of said conductive traces.
A method for making a carrier for a semiconductor device, said method comprising:
- locating at least one conductive trace on a core material;
- forming a die attach material over said core material;
- and
- forming a plurality of pockets in said die attach material extending to said at least one conductive trace.
A method for making a semiconductor device comprising:
- assembling a carrier, comprising:
- locating at least one conductive trace on a core material;
- forming a die attach material over said core material;
- forming a plurality of pockets in said die attach material extending to said at least one conductive trace;
- and
- electrically connecting said carrier to a semiconductor die.
Dependencies are inferred from the claim text.