Film forming method and film forming apparatus
AssigneeTokyo Electron Limited
InventorsYasuhiro Sakamoto, Hidetami Yaegashi
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Abstract
A polyimide solution is supplied to a wafer and the wafer is rotated by means of a spin chuck, thereby forming a polyimide film on the wafer. An irradiator for irradiating a laser beam to a peripheral portion of the wafer W is provided. After the polyimide film is formed and side rinse is performed, a laser beam is irradiated to the peripheral portion to solidify the film at the peripheral portion. The solidified polyimide film forms a weir, thus preventing the polyimide solution which has not dried yet from flowing out toward a peripheral edge portion.
Claims21
A film forming method, comprising the steps of:
- supplying a processing solution to a substrate to form a film of the processing solution with a predetermined thickness on a front surface of the substrate;
- removing the film of the processing solution formed at a peripheral edge portion of the substrate;
- and
- solidifying the film of the processing solution formed at a peripheral portion on the inside of the peripheral edge portion of the substrate.
A film forming apparatus, comprising:
- means for supplying a processing solution to a substrate to form a film of the processing solution with a predetermined thickness on the front surface of the substrate;
- means for removing the film of the processing solution formed at a peripheral edge portion of the substrate;
- and
- means for solidifying the film of the processing solution formed at a peripheral portion on the inside of the peripheral edge portion of the substrate.
Dependencies are inferred from the claim text.