Single chamber vacuum processing tool

A fabrication system comprising:

• a plurality of tools comprising:
• a load lock/transfer chamber having a first sealable slit and a second sealable slit;
• a single vacuum processing chamber coupled to the second sealable slit;
• a substrate handler contained within the load lock/transfer chamber adapted to transfer a substrate through the second slit to the processing chamber;
• and
• a rotatable substrate carriage contained within the load/lock transfer chamber, wherein the substrate handler is configured to transfer a substrate between the substrate carriage and the processing chamber and further wherein the substrate carriage comprises three horizontally adjacent substrate locations, wherein the substrate carriage is configured to lift and lower so as to transfer a substrate between the substrate carriage and the substrate handler;
• and
• a front end loader robot configured to load substrates to each of the tools via the tool's first sealable slit.

A fabrication system comprising:

• a plurality of tools comprising:
• a load lock/transfer chamber having a first sealable slit and a second sealable slit;
• a single vacuum processing chamber coupled to the second sealable slit;
• a plurality of substrate storage members within the load lock/transfer chamber;
• a substrate handler contained within the load lock/transfer chamber configured to transfer a substrate through the second slit to the processing chamber;
• wherein the substrate handler is a linear substrate handler configured to transfer a substrate between the plurality of substrate storage members and the processing chamber;
• and
• a front end loader robot configured adapted to load substrates to each of the tools via the tool's first sealable slit.

A fabrication system comprising:

• a plurality of the tools comprising:
• a load lock/transfer chamber having a first sealable slit and a second sealable slit;
• a single vacuum processing chamber coupled to the second sealable slit;
• a substrate handler contained within the load lock/transfer chamber adapted to transfer a substrate through the second slit to the processing chamber;
• and
• a plurality of substrate storage members within the load lock/transfer chamber, and wherein the substrate handler is a linear substrate handler adapted to transfer a substrate between the plurality of substrate storage members and the processing chamber;
• wherein the plurality of substrate storage members comprise a rotatable substrate carriage and wherein the substrate carriage is adapted to lift and lower so as to transfer a substrate between the substrate carriage and the substrate handler;
• and
• a front end loader robot adapted to load substrates to each of the tools via the tool's first sealable slit.

A fabrication system comprising:

• a plurality of tools comprising:
• a load lock/transfer chamber having a first sealable slit and a second sealable slit;
• a single vacuum processing chamber coupled to the second sealable slit;
• a substrate handler contained within the load lock/transfer chamber adapted to transfer a substrate through the second slit to the processing chamber;
• and
• a rotatable substrate carriage contained within the load/lock transfer chamber, wherein the substrate handler is configured to transfer a substrate between the substrate carriage and the processing chamber and further wherein the substrate carriage comprises three horizontally adjacent substrate locations, wherein the substrate carriage is configured to lift and lower so as to transfer a substrate between the substrate carriage the temperature adjustment plate and the substrate handler;
• and a temperature adjustment plate and
• a front end loader robot configured to load substrates to each of the tools via the tool's first sealable slit.

A method comprising:

• placing a plurality of substrates within a load lock/transfer chamber on a rotatable substrate carriage, having a plurality of horizontally adjacent storage locations;
• pumping the load lock/transfer chamber to a desired vacuum level;
• opening a sealable slit that connects the load lock/transfer chamber to a vacuum processing chamber;
• transferring a first substrate through the sealable slit into the vacuum processing chamber via a substrate handler contained within the load lock/transfer chamber;
• wherein the load lock/transfer chamber is dedicated to transferring wafers to and from a single vacuum processing chamber;
• storing one of the substrates within the load lock/transfer chamber while processing the first substrate within the vacuum processing chamber;
• and
• further comprising transferring a substrate to the substrate handler via positioning a storage location above the substrate handler, and changing the elevation of the substrate carriage relative to the substrate handler.