Electromagnetic interference cover for an electronics module, method of manufacture therefore and an electronic equipment chassis employing the same

An electronic equipment chassis, comprising:

• a frame;
• an electronics module configured to be received within said frame and configured to house electrical components capable of generating electromagnetic emissions that cause electromagnetic interference (EMI), said electronics module having an EMI module cover, including:
• a conductive sidepanel having a resilient cantilever member formed therefrom, said resilient cantilever member having a fixed end integrally formed with said sidepanel and a movable end free of a module coupler, thereby to allow said resilient cantilever member to flex as said module is installed in a chassis;
• and
• a boss formed proximate said movable free end and extending outwardly from said sidepanel a distance sufficient to provide a conductive path between said conductive sidepanel and an adjacent conductive surface when said module is installed in said chassis.

An electronics module configured to be received within a frame of an electronics chassis and capable of generating electromagnetic emissions that cause electromagnetic interference (EMI), comprising;

• an electrical components housing having interlocking opposing sidewalls, at least one of said sidewalls being an EMI module cover comprising;
• a conductive sidepanel having a resilient cantilever member formed therefrom, said resilient cantilever member having a fixed end integrally formed with said sidepanel and a movable end free of a sidewalls coupler, thereby to allow said resilient cantilever member to flex as said electrical components housing is installed in said electronics chassis;
• and
• a boss formed proximate said movable free end and extending outwardly from said sidepanel a distance sufficient to provide a conductive path between said conductive sidepanel and an adjacent conductive surface when said module is installed in said electronic chassis.