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AssigneeTyveleijn
InventorJOHANNES H. TYVELEIJN
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The invention relates to a holder (10) for a semiconductor substrate (1) comprising a main body (2) which is provided with three or more projections (3) by means of which the substrate (1) can be held fixed in the holder (10). Two projections (3A, 3B) are fixedly connected, and a third projection (3C) present opposite the other two (3A, 3B) is movably connected to the main body (2). The third projection (3C) can be moved away from the other two (3A, 3B) and is urged towards the latter two by means (4). According to the invention, a lateral side (5) of each projection (3) facing towards the substrate (1) to be inserted is provided with a convex recess (6) whose geometry is such that exclusively the outermost edges of both the upper surface and the lower surface of the substrate (1) to be inserted come into contact with the convex recess (6). A substrate (1), for example a round substrate, can be satisfactorily fastened in such a holder (10) while still its entire surface area can be processed. Given a suitable placement of the projections (3), fluctuations in diameter and thickness of the substrate (1) to be inserted are compensated for. The projections (3) have a diabolo shape in a preferred embodiment. The accessibility of the substrate (1) is substantially optimized by this. In addition, such a holder (10) can be simply and inexpensively manufactured. A holder (10) according to the invention is particularly suitable for treatments of the semiconductor substrate (1) as part of the manufacture of semiconductor devices such as diodes, in particular in steps such as the provision or removal of a (semi)conducting or insulating layer.
A holder (10) for a semiconductor substrate (1) comprising a main body (2) which is provided with three or more projections (3) between which the semiconductor substrate (1) can be fixed in the holder (10) and of which at least a first and a second projection (3A, 3B) are fixedly connected to the main body (2), while a third projection (3C) which is present opposite the first and the second projection (3A, 3B) is movably connected to the holder (10) and can be moved in a direction away from the first and the second projection (3A, 3B), while the holder (10) is provided with means (4) by which the third projection (3C) is urged towards the first and the second projection (3A, 3B), characterized in that a lateral side (5) of each projection (3) facing towards the semiconductor substrate (1) to be inserted is provided with a convex recess (6) whose geometry is such that exclusively the outermost edges of the both the upper surface and the lower surface of the semiconductor substrate (1) to be inserted come into contact with said convex recess (6).
A holder (10) as claimed in any one of the preceding claims, characterized in that the first and the second projection (3A, 3B) lie within two mutually adjoining quadrants of the main body, when viewed in projection, and the third projection (3C) lies outside said quadrants, when viewed in projection, and preferably at a distance to the first and the second projection (3A, 3B) which is as great as possible.
A holder (10) as claimed in any one of the preceding claims, characterized in that the holder (10) comprises exactly three projections (3) which are present approximately in the corner points of an equilateral triangle.
A holder (10) as claimed in any one of the preceding claims, characterized in that the third projection (3C) is provided with a pin (9), in that the means (4) by which the third projection (3C) is urged towards the first and the second projection (3A, 3B) comprise a spring (4) fastened to the main body (2) and to the third projection (3C), in that the first and the second projection (3A, 3B) are each connected to the main body (2) by means of a rivet joint, and in that all components (2, 3, 4) of the holder (10) are made from stainless steel.
A method of manufacturing a semiconductor device whereby the surface of a semiconductor substrate (1) is provided with a conducting, semiconducting, or insulating region, or is divested of such a region, and whereby the semiconductor substrate (1) is fastened in a holder (10) for the purpose of providing or removing said region, characterized in that the holder (10) is a holder (10) as claimed in any one of the preceding claims.
Dependencies are inferred from the claim text.