Method of mounting chip onto printed circuit board in shortened working time

A method of mounting a semiconductor chip onto a printed circuit board, comprising:

• forming a conductive bump on an upward front side of a wafer;
• dicing the wafer on a first support member so as to cut out individual semiconductor chips;
• superposing a second support member over the first support member so as to hold the semiconductor chips between the first and second support members;
• reversing the first support member along with the second support member holding the semiconductor chips therebetween;
• picking up the individual semiconductor chips after removing the first support member.

A method of making a semiconductor chip, comprising:

• forming a conductive bump on an upward front side of a wafer;
• reversing the wafer;
• and
• forming a resin lamination on a backside of the wafer.

A method of making a semiconductor chip, comprising:

• locating a wafer receiving a conductive bump on an upward front side;
• adhering an underfill material sheet onto the upward front side of the wafer;
• reversing the wafer;
• and
• dicing the wafer from a backside of the wafer.

A semiconductor chip comprising:

• a conductive bump;
• a chip body receiving the conductive bump at a downward front side;
• a flange extending outward from a periphery of the chip body;
• and
• an evaporated resin lamination extending along an upward surface of the flange, the periphery of the chip body and an upward backside of the chip body.

A method of mounting a semiconductor chip onto a printed circuit board, comprising:

• locating a wafer receiving an underfill material sheet on a downward front side receiving a conductive bump;
• forming a nick along a contour of the semiconductor chip on an upward backside of the wafer;
• forming an evaporated resin lamination on the upward backside of the wafer;
• cutting out an individual semiconductor chip along the nick with an incision narrower than the nick;
• and
• urging the individual semiconductor chip against the printed circuit board.

An underfill material supplying film comprising:

• a thin film tape;
• and
• an underfill material sheet superposed on a surface of the thin film tape, wherein
• a through hole is defined to continuously penetrate through the thin film tape and the underfill material sheet.

A semiconductor chip mounter comprising:

• a platen;
• a bonding head opposing a chip receiving surface to the platen;
• and
• an electromagnetic wave output opening defined at the chip receiving surface of the bonding head.

A method of mounting a semiconductor chip onto a printed circuit board, comprising:

• attaching the semiconductor chip, receiving a conductive bump embedded in an underfill material sheet, to a chip receiving surface of a bonding head;
• detecting a shadow of the conductive bump based on an electromagnetic wave penetrating through the semiconductor chip;
• and
• positioning the bonding head based on the shadow of the conductive bump.

A semiconductor chip mounter comprising:

• a platen;
• a bonding head opposing a chip receiving surface to the platen;
• and
• an irradiation source opposed to the chip receiving surface of the bonding head so as to irradiate an electromagnetic wave toward the chip receiving surface.

A method of mounting a semiconductor chip onto a printed circuit board, comprising:

• attaching the semiconductor chip, receiving a conductive bump embedded in an underfill material sheet, to a chip receiving surface of a bonding head;
• irradiating an electromagnetic wave toward the underfill material sheet;
• photographing a fluorescent light of the underfill material sheet;
• and
• positioning the bonding head based on an intensity of the fluorescent light.