Apparatus and methods of packaging and testing die

A stacked die package coupleable with a circuit board, comprising:

• a packaging substrate including a first surface having a recess disposed therein and a plurality of conductive leads formed thereon, each conductive lead having an inner end proximate the recess and an outer end coupleable with the circuit board;
• a first die attached to the packaging substrate within the recess and having a plurality of first bond pads disposed thereon, each first bond pad being electrically coupled to one of the inner ends;
• and
• a second die attached to the first die and having a plurality of second bond pads disposed thereon, each second bond pad being electrically coupled to one of the inner ends, the first surface of the packaging substrate being proximate the circuit board when the outer ends are coupled with the circuit board.

A die package created by a method of packaging and testing, comprising:

• testing a die having a plurality of bond pads formed thereon;
• determining that the die has tested successfully;
• providing a packaging substrate including a first surface having a recess formed therein and a plurality of conductive leads coupled thereto;
• attaching the die to the packaging substrate within the recess and with the bond pads electrically coupled to at least some of the conductive leads to form the die package;
• and
• testing the die package.

A stacked die package created by a method of packaging and testing, comprising:

• testing a first die having a plurality of first bond pads formed thereon;
• determining that the first die has tested successfully;
• testing a second die having a plurality of second bond pads formed thereon;
• determining that the second die has tested successfully;
• attaching the second die to the first die;
• providing a packaging substrate including a first surface having a recess formed therein and a plurality of conductive leads coupled thereto;
• attaching the first die to the packaging substrate within the recess and with the first and second bond pads electrically coupled to at least some of the conductive leads to form the stacked die package;
• and
• testing the stacked die package.

A method of packaging and testing a die package, comprising:

• testing a die having a plurality of bond pads formed thereon;
• determining that the die has tested successfully;
• providing a packaging substrate including a first surface having a recess formed therein and a plurality of conductive leads coupled thereto;
• attaching the die to the packaging substrate within the recess and with the bond pads electrically coupled to at least some of the conductive leads to form the die package;
• and
• testing the die package.

A method of packaging and testing a stacked die package, comprising:

• testing a first die having a plurality of first bond pads formed thereon;
• determining that the first die has tested successfully;
• testing a second die having a plurality of second bond pads formed thereon;
• determining that the second die has tested successfully;
• attaching the second die to the first die:
• providing a packaging substrate including a first surface having a recess formed therein and a plurality of conductive leads coupled thereto;
• attaching the first die to the packaging substrate within the recess and with the first and second bond pads electrically coupled to at least some of the conductive leads to form the stacked die package;
• and
• testing the stacked die package.