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AssigneeMicron Technology, Inc.
InventorsJIGISH D. TRIVEDI, ZHONGZE WANG, RONGSHENG YANG
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In accordance with an aspect of the invention, a semiconductor processing method of forming field effect transistors includes forming a first gate dielectric layer over a first area configured for forming p-type field effect transistors and a second area configured for forming n-type field effect transistors, both areas on a semiconductor substrate. The first gate dielectric layer is silicon dioxide having a nitrogen concentration of 0.1% molar to 10.0% molar within the first gate dielectric layer, the nitrogen atoms being higher in concentration within the first gate dielectric layer at one elevational location as compared to another elevational location. The first gate dielectric layer is removed from over the second area while leaving the first gate dielectric layer over the first area, and a second gate dielectric layer is formed over the second area. The second gate dielectric layer is a silicon dioxide material substantially void of nitrogen atoms. Transistor gates are formed over the first and second gate dielectric layers, and then p-type source/drain regions are formed proximate the transistor gates in the first area and n-type source/drain regions are formed proximate the transistor gates in the second area.
A semiconductor processing method of forming field effect transistors comprising:
A semiconductor processing method of forming field effect transistors comprising:
A semiconductor processing method of forming field effect transistors comprising:
Integrated circuitry comprising a semiconductor substrate having an area within which a plurality of n-type and p-type field effect transistors are formed, the respective transistors comprising a gate, a gate dielectric layer and source/drain regions, the gate dielectric layer of the p-type field effect transistors comprising an oxide having nitrogen atoms therein, and the nitrogen atoms being higher in concentration within the gate dielectric layer at one elevational location as compared to another elevational location, the gate dielectric layer of the n-type field effect transistors being different in composition from the gate dielectric layer of the p-type field effect transistors.
Integrated circuitry comprising a semiconductor substrate having an area within which a plurality of n-type and p-type field effect transistors are formed, the respective transistors comprising a gate, a gate dielectric layer and source/drain regions, the gate dielectric layer of the p-type field effect transistors comprising silicon dioxide having nitrogen atoms therein, the nitrogen atoms being higher in concentration within the gate dielectric layer at one elevational location as compared to another elevational location and at a concentration of from 0.1% molar to 10.0% molar, the gate dielectric layer of the n-type field effect transistors comprising silicon dioxide material proximate an interface of the gate dielectric layer with the semiconductor substrate which is substantially void of nitrogen atoms.
A semiconductor processing method of forming field effect transistors comprising:
Dependencies are inferred from the claim text.