Semiconductor device having nonvolatile memory and method of manufacturing thereof
AssigneeHitachi, Ltd.
InventorsTAKASHI KOBAYASHI, ATSUKO KATAYAMA
Life of this patent
Estimating the term…
Loading patent…
AssigneeHitachi, Ltd.
InventorsTAKASHI KOBAYASHI, ATSUKO KATAYAMA
Estimating the term…
Described is a semiconductor device having a silicon oxide (Sio2) film into which nitrogen atoms, in a range between approximately 2×1020 atoms/cm3 or more and 2×1021 atoms/cm3 or less, are introduced, used as an insulator film in the semiconductor device. For example, the device can be a nonvolatile memory device, and the silicon oxide film can be used as an insulator film between, e.g., a floating gate electrode and control gate electrode of the nonvolatile memory device. Stable operations and a retention capability of a nonvolatile memory device are obtained even if the nonvolatile memory device is scaled. Moreover, a programming voltage can be lowered. Also described are methods of fabricating the semiconductor device.
A semiconductor device comprising a silicon oxide film formed between a first silicon film and a second silicon film, the first silicon film overlying a substrate, the silicon oxide film having nitrogen included therein, a maximum nitrogen concentration in the silicon oxide film being in a range from 2×1020 atoms/cm3 to 2×1021 atoms/cm3.
A semiconductor device comprising a silicon oxide film formed between a first silicon film and a second silicon film, the first silicon film overlying a substrate, the silicon oxide film having nitrogen included therein, the silicon oxide film having a nitrogen concentration profile in a direction from the second silicon film to the first silicon film, the nitrogen concentration profile having a maximum adjacent the first silicon film, the nitrogen concentration at the maximum adjacent the first silicon film being at least 2×1020 atoms/cm3.
A semiconductor device comprising a silicon oxide film between a first silicon film and a second silicon film, the first silicon film overlying a substrate, wherein the silicon oxide film has a maximum hydrogen concentration of 5×1020 atoms/cm3, and wherein each of the first and second silicon films is made of amorphous silicon or of polycrystalline silicon.
A method of manufacturing a semiconductor device, comprising the steps of:
A method of manufacturing a nonvolatile memory device having an electrode in a floating state, an insulating film and a further electrode, comprising the steps of:
Dependencies are inferred from the claim text.