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US 2001/0040158 A1Published application
Hot plate unit
AssigneeIbiden Co., Ltd.
InventorsJo Saito, Masakazu Furukawa, Yasutaka Ito
Life of this patent
Estimating the term…
Abstract
A hot plate unit for heating semiconductor wafers. The hot plate unit includes a case, a hot plate, a seal element, and a holding ring. The seal element is made of a heat insulative material and is arranged between the case and the hot plate. The hot plate is clamped between the holding ring and the seal element. Screws for fastening the holding ring do not contact the hot plate.
Claims7
A hot plate unit comprising:
- a case having a lip;
- a hot plate having a heat generator, wherein the hot plate is made of sintered ceramic;
- and
- a holder for securing the hot plate to the case, wherein the holder contacts a peripheral portion of the upper surface of the hot plate when the holder is fixed to the case.
1 more element
Dependencies are inferred from the claim text.