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US 2001/0040098 A1Published application
Processing apparatus and processing system
AssigneeTokyo Electron Limited
InventorsWataru Okase, Takenobu Matsuo
Life of this patent
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Abstract
A plating system is composed of a transfer device for performing transfer of a wafer, a plating unit and a washing/drying unit provided around the transfer device. Each unit is structured to be detachable from the plating system. The plating unit is divided into a wafer transfer section and a plating section by a separator, and atmosphere of each section is independently set.
Claims33
A processing apparatus comprising:
- a chamber which has a first area for performing a delivery of a processing object between an outer section and the chamber, and a second area for providing given processing to the processing object;
- a process solution bath being provided in said second area and reserving a process solution;
- a processing mechanism which provides predetermined processing to said processing object using said process solution in said second area;
- a sucking line being provided in said first area and sucking atmosphere of said first area in the vicinity of a boundary between said first area and said second area;
- and
- an exhaust line, provided in said second area, for exhausting atmosphere in said second area to the outer section in the vicinity of the boundary between said first area and said second area.
3 more elements
A processing system including:
- a transfer device which transfers a processing object;
- and
- a processing apparatus which provides predetermined processing to the processing object transferred by said transferring device;
- said processing apparatus comprising:
- a chamber having a first area for performing a delivery of a processing object between an outer section and the chamber, and a second area for providing given processing to the processing object;
- a process solution bath being provided in said second area and reserving a process solution;
- a processing mechanism which provides predetermined processing to said processing object using said process solution in said second area;
- a sucking line being provided in said first area and sucking atmosphere of said first area in the vicinity of a boundary between said first area and said second area;
- and
- an exhaust line being provided in said second area and exhausting atmosphere in said second area to the outer section in the vicinity of the boundary between said first area and said second area.
7 more elements
A processing apparatus comprising:
- a process solution bath having a first electrode in its interior and containing a process solution;
- a holding tool which holds a processing object to dip said processing object in said process solution;
- a pressing tool being provided in the interior of said holding tool to be movable up and down and moving down to press said processing object to be fixed when said holding tool holds said processing object;
- and
- a second electrode, provided in said holding tool, which contacts electrically with said processing object held by said holding tool, wherein said pressing tool comprises a third electrode, which is provided at a position opposite to said second electrode, and which comes in electrical contact with said second electrode when said holding member moves down in a state that no processing object is held, and a measuring device for detecting a contact state between said second electrode and said third electrode.
2 more elements
A processing system including:
- a transfer device which transfers a processing object;
- and
- a processing apparatus which provides predetermined processing to the processing object transferred by said transferring device;
- said processing apparatus comprising:
- a process solution bath having a first electrode in its interior and containing a process solution;
- a holding tool which holds a processing object to dip said processing object in said process solution;
- a pressing tool being provided in the interior of said holding tool to be movable up and down being moving down to press said processing object to be fixed when said holding tool holds said processing object;
- and
- a second electrode, provided in said holding tool, which contacts electrically with said processing object held by said holding tool, wherein said pressing tool comprises third electrodes, which are provided at a position opposite to said second electrode, and which comes in electrical contact with said second electrode when said holding member moves down in a state that no processing object is held, and a measuring device for detecting a contact state between said second electrode and said third electrodes.
6 more elements
A processing apparatus comprising:
- a chamber having a first area for performing a delivery of a processing object between an outer section and the chamber, and a second area for providing given processing to the processing object;
- a process solution bath being provided in said second area and reserving a process solution;
- a processing mechanism which provides predetermined processing to said processing object using said process solution in said second area;
- and
- a separator which separates said first area and said second area from each other.
2 more elements
A connection checking method using a processing apparatus, said processing apparatus comprising:
- a process solution bath having a first electrode in its interior and containing a process solution;
- a holding tool which holds a processing object to dip said processing object in said process solution;
- a pressing tool being provided in the interior of said holding tool to be movable up and down and moving down to press said processing object to be fixed when said holding tool holds said processing object;
- a second electrode, provided in said holding tool, which contacts electrically with said processing object held by said holding tool;
- and
- a third electrode, which is provided at a position opposite to said second electrode, wherein a predetermined voltage is applied to said processing object and said first electrode in a state that said processing object is dipped in said process solution, whereby providing predetermined processing to said processing object,
- said connection checking method for checking a contact state of said second electrode, comprising the steps of:
- moving down said pressing tool in a state that no holding member holds said processing object such that said second electrode and said third electrode are brought in contact with each other;
- and
- detecting a contact state between said second electrode and said third electrode.
7 more elements
A processing method using a processing apparatus, said processing apparatus comprising:
- a process solution bath having a first electrode in its interior and containing a process solution;
- a holding tool which holds a processing object to dip said processing object in said process solution;
- a pressing tool being provided in the interior of said holding tool to be movable up and down and moving down to press said processing object to be fixed when said holding tool holds said processing object;
- a second electrode, provided in said holding tool, which contacts electrically with said processing object held by said holding tool;
- and
- a third electrode, which is provided at a position opposite to said second electrode, wherein a predetermined voltage is applied to said processing object and said first electrode in a state that said processing object is dipped in said process solution, whereby providing predetermined processing to said processing object,
- said processing method comprising the steps of:
- moving down said pressing tool in a state that no holding member holds said processing object such that said second electrode and said third electrode are brought in contact with each other;
- detecting a contact state between said second electrode and said third electrode;
- and
- controlling an operation of said processing apparatus based on said detected contact state.
8 more elements
Dependencies are inferred from the claim text.