Production line for mounting electronic components

An apparatus having a plurality of mounting apparatus of electronic components, said mounting apparatus having a plurality of component feeding units, and a component mounting unit for receiving electronic components from the feeding units and for mounting electronic components on a print circuit board, the apparatus comprising:

• a memory means for recording a number of total pick-up procedures of an electronic component and a number of unsuccessful pick-up procedures of the electronic component for each of the feeding units of the mounting apparatus;
• a computation means for calculating a malfunction rate from the number of total pick-up procedures and the number of unsuccessful pick-up procedures and for comparing the malfunction rate to a predetermined value at a predetermined time for evaluating the malfunction rate;
• a selection means for choosing an alternate component feeding unit on one of said plurality of mounting apparatus, the alternate feeding unit supplying a same electronic component as a unit having a higher malfunction rate than the predetermined value;
• and
• a control means for having the alternate component feeding unit supplying the electronic component for mounting on the print circuit board, and for having the component feeding unit with the malfunction rate higher than the predetermined value discontinuing supplying the electronic component.

A method of mounting electronic components with a plurality of mounting apparatus of electronic components, said mounting apparatus having a plurality of component feeding units, and a component mounting unit for receiving electronic components from the feeding units and for mounting electronic components on a print circuit board, the method comprising:

• recording a malfunction rate for each of the feeding units of the mounting apparatus;
• comparing the malfunction rate to a predetermined value at a predetermined time for evaluating the malfunction rate;
• choosing an alternate component feeding unit on one of said plurality of mounting apparatus, the alternate feeding unit supplying a same electronic component as a unit having a higher malfunction rate than the predetermined value;
• having the alternate component feeding unit supplying the electronic component for mounting on the print circuit board;
• having the component feeding unit with the malfunction rate higher than the predetermined value discontinuing supplying the electronic component;
• wherein an upstream mounting apparatus mounts the electronic component which is to be mounted by an downstream mounting apparatus when the component feeding unit of the downstream mounting apparatus has the malfunction rate higher than the predetermined value, said print circuit board being transported from the upstream mounting apparatus toward the downstream mounting apparatus after the electronic component and all the electronic components to be mounted in the upstream mounting apparatus are mounted on the print circuit board in the upstream mounting apparatus;
• and
• wherein a downstream mounting apparatus mounts the electronic component which is to be mounted by an upstream mounting apparatus when the component feeding unit of the upstream mounting apparatus has the malfunction rate higher than the predetermined value, said print circuit board being transported from the upstream mounting apparatus toward the downstream mounting apparatus after all the other electronic components to be mounted in the upstream mounting apparatus are mounted on the print circuit board in the upstream mounting apparatus.

A method of mounting electronic components with a plurality of mounting apparatus of electronic components, said mounting apparatus having a plurality of component feeding units, and a component mounting unit for receiving electronic components from the feeding units and for mounting electronic components on a print circuit board, the method comprising:

• recording a number of total pick-up procedures of an electronic component and a number of unsuccessful pick-up procedures of the electronic component for each of the feeding units of the mounting apparatus;
• calculating a malfunction rate from the number of total pick-up procedures and the number of unsuccessful pick-up procedures at a predetermined time for evaluating the malfunction rate;
• comparing the malfunction rate to a predetermined value;
• choosing an alternate component feeding unit on one of said plurality of mounting apparatus, the alternate feeding unit supplying a same electronic component as a unit having a higher malfunction rate than the predetermined value;
• having the alternate component feeding unit supplying the electronic component for mounting on the print circuit board;
• having the component feeding unit with the malfunction rate higher than the predetermined value discontinuing supplying the electronic component;
• wherein an upstream mounting apparatus mounts the electronic component which is to be mounted by an downstream mounting apparatus when the component feeding unit of the downstream mounting apparatus has the malfunction rate higher than the predetermined value, said print circuit board being transported from the upstream mounting apparatus toward the downstream mounting apparatus after the electronic component and all the electronic components to be mounted in the upstream mounting apparatus are mounted on the print circuit board in the upstream mounting apparatus;
• and
• wherein a downstream mounting apparatus mounts the electronic component which is to be mounted by an upstream mounting apparatus when the component feeding unit of the upstream mounting apparatus has the malfunction rate higher than the predetermined value, said print circuit board being transported from the upstream mounting apparatus toward the downstream mounting apparatus after all the other electronic components to be mounted in the upstream mounting apparatus are mounted on the print circuit board in the upstream mounting apparatus.