Methods of forming an integrated circuit device

An integrated circuit device comprising:

• a semiconductor die having a plurality of bond pads;
• a plurality of leads electrically coupled with the bond pads of the semiconductor die;
• a first housing encapsulating the semiconductor die and at least a portion of the leads;
• a heat sink thermally coupled with the first housing;
• and
• a second housing encapsulating at least a portion of the heat sink.

An integrated circuit device comprising:

• a first housing formed about a semiconductor die and at least portions of a plurality of leads electrically coupled with the semiconductor die;
• a heat sink thermally coupled with the first housing;
• and
• a second housing formed about the heat sink and at least a portion of the first housing.

A synchronous-link dynamic random access memory device comprising:

• a semiconductor die bearing synchronous-link dynamic random access memory circuitry and having a plurality of bond pads coupled therewith;
• a plurality of leads electrically coupled with the bond pads of the semiconductor die;
• a first housing encapsulating the semiconductor die and at least a portion of the leads;
• a heat sink positioned proximate the first housing and configured to draw heat from the semiconductor die;
• and
• a second housing encapsulating the heat sink and at least a portion of the first housing.

A method of forming an integrated circuit device comprising:

• providing a semiconductor die;
• forming a first housing about the semiconductor die;
• thermally coupling a heat sink with the first housing;
• and
• forming a second housing about at least a portion of the heat sink following the thermally coupling.

A method of forming an integrated circuit device comprising:

• providing a semiconductor die having a plurality of bond pads;
• providing a first lead frame having a plurality of leads;
• providing a second lead frame having a heat sink;
• electrically coupling the bond pads of the semiconductor die with the leads of the first lead frame;
• first encapsulating the semiconductor die and at least a portion of the leads, the first encapsulating forming a first housing;
• thermally coupling the heat sink with the first housing;
• and
• second encapsulating at least a portion of the heat sink forming a second housing following the thermally coupling.

A method of forming an integrated circuit device comprising:

• providing a semiconductor die electrically coupled with a plurality of leads;
• forming a first housing about the semiconductor die and at least a portion of the leads;
• providing a heat sink;
• and
• forming a second housing about at least a portion of the heat sink, the forming the second housing thermally coupling the heat sink with the semiconductor die.

A method of forming a synchronous-link dynamic random access memory edge-mounted device comprising:

• providing a semiconductor die having a plurality of bond pads;
• providing a first lead frame having a plurality of leads;
• providing a second lead frame having a heat sink;
• electrically coupling the bond pads of the semiconductor die with the leads of the first lead frame;
• positioning the semiconductor die and the first lead frame within a first mold following the electrically coupling;
• first encapsulating the semiconductor die and at least a portion of the leads within the first mold using a first encapsulant;
• curing the first encapsulant forming a first housing;
• removing the first housing from the first lead frame;
• positioning the heat sink of the second lead frame to contact a surface of the first housing;
• providing the semiconductor die and the second lead frame within a second mold following the positioning the heat sink;
• second encapsulating the first housing and the heat sink within the second mold using a second encapsulant;
• curing the second encapsulant forming a second housing;
• removing the second housing from the second lead frame;
• trimming the leads;
• and
• bending the leads to form one of a vertical surface mounted package and a horizontal surface mounted package.