Polishing silicon wafers
AssigneeDudovicz
InventorWALTER DUDOVICZ
Life of this patent
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Abstract
An endless belt for a belt type polishing machine comprises a support fabric and a polymer layer of relatively low hardness. The polymer layer is formed with drainage grooves. The support fabric may comprise a non woven or woven material, or a membrane with oriented reinforcing yarns. A further version comprises a spiral-link fabric supporting a woven or non woven layer carrying the polymer layer. The polymer layer may be a double layer, the upper of which is either harder or softer than the lower layer.
Claims28
For use in polishing silicon wafers, an endless belt to act as a polishing tool, wherein said belt comprises a woven or non-woven fabric coated with a suitable polymer.
Dependencies are inferred from the claim text.