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US 2001/0034186 A1Published application
Polishing apparatus
OwnerShuzo Sato, Hiizu Ootorii +1inventors
InventorsShuzo Sato, Hiizu Ootorii, Takaaki Kozuki
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OwnerShuzo Sato, Hiizu Ootorii +1inventors
InventorsShuzo Sato, Hiizu Ootorii, Takaaki Kozuki
Estimating the term…
A polishing wheel is pushed up and down in the Z-axis direction owing to a wafer surface shape. And the polishing amount depends on the height of protrusions on a wafer surface. Where a spindle is a rigid body in the Z-axis direction, the pressing force of the polishing wheel caused by vertical movement of a tool varies depending on the position on a wafer and hence polishing is not performed uniformly To solve this problem, the spindle is provided with a Z-axis parallel leaf spring mechanism. Push-up and push-down actions of the polishing wheel are absorbed by displacement of the parallel leaf spring mechanism. This enables uniform polishing. Since the tool can be hardened, the flatness can also be improved.
A polishing apparatus for polishing and finishing a thin-plate-like object so that the object is made flat and uniform in height by pressing the object being in contact with a surface of a table that is provided parallel with a horizontal surface by means of a polishing wheel that is opposed to the object, comprising:
A polishing apparatus in which a pad is stuck to a rotary table that is provided parallel with a horizontal surface, an object that is opposed to the pad is pressed against a pad side while rotating the object, and a pad conditioner is provided that is in contact with the pad, comprising:
Dependencies are inferred from the claim text.