Cmp uniformity
AssigneeInfineon Technologies AG
InventorsCHENTING LIN, ROBERT VAN DEN BERG, SUMIT PANDEY
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Abstract
Improved CMP uniformity is achieved by providing improved control of the slurry distribution. Improved slurry distribution is achieved by, for example, the use of a slurry dispenser that dispenses slurry from a plurality of dispensing points. Providing a squeeze bar between the slurry dispenser and wafer to redistribute the slurry also improves the slurry distribution.
Claims35
During polishing of a semiconductor wafer, a method for controlling a slurry distribution comprising:
- rotating a polishing pad;
- and
- dispensing a slurry from a plurality of slurry dispensing outlets onto the polishing pad.
A method for controlling slurry distribution during polishing comprising:
- rotating a polishing pad;
- dispensing slurry onto the polishing pad from a slurry dispenser;
- and
- shaping the slurry on the pad with a squeeze bar.
A polishing system comprising:
- a polishing pad mounted on a rotatable platen configured to support and rotate said polishing pad;
- a slurry dispensing system for dispensing slurry onto the polishing pad, the slurry dispensing system comprises a plurality of outlets for dispensing slurry therefrom.
A polishing system comprising:
- a polishing pad mounted on a rotatable platen configured to support and rotate said polishing pad;
- a substrate carrier for supporting a substrate;
- a slurry dispenser for dispensing slurry onto the polishing pad;
- and
- a squeeze bar mount supporting a squeeze bar for redistribute the slurry.
Dependencies are inferred from the claim text.